Perovskite Solar Module Encapsulation for Moisture and Oxygen Barrier

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Solution Overview

Problem

Perovskite solar cells face instability due to decomposition from moisture and oxygen ingress, which is exacerbated by the vacuum-assisted thermal curing encapsulation process, leading to reduced lifespan.

Innovation Solution

An encapsulation structure comprising a first inorganic layer and second inorganic layers, optionally with organic layers, stacked to form a shell structure that encapsulates the perovskite solar module in both horizontal and vertical directions, combined with a transparent encapsulation cover plate, to prevent moisture and oxygen ingress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vacuum-assisted thermal curing encapsulation process is used, then encapsulation efficiency is improved, but perovskite layer decomposition is induced due to elevated temperatures

Engineering Contradiction:
Improveencapsulation efficiencyVSAvoidperovskite layer stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent changes the temperature parameter from elevated thermal curing to low-temperature or room-temperature curing processes. This allows the encapsulation to achieve adequate bonding and sealing without exposing the perovskite layer to temperatures that would cause decomposition, thus resolving the contradiction between encapsulation efficiency and perovskite stability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal curing mechanism with alternative curing methods such as UV curing or chemical curing at ambient temperatures. This substitution eliminates the harmful thermal effect while maintaining the encapsulation bonding function, protecting the perovskite layer from temperature-induced decomposition

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Device complexity

If single-layer encapsulation is used, then device complexity is reduced, but moisture and oxygen ingress from edges occurs

Engineering Contradiction:
Improveencapsulation structure complexityVSAvoidmoisture and oxygen ingress
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the encapsulation into multiple functional layers: a bottom encapsulation layer, side wall encapsulation, and top encapsulation layer. Each layer addresses specific ingress paths (bottom, sides, top), creating comprehensive protection without requiring overly complex integrated structures

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs nested encapsulation where inner encapsulation layers are placed within outer encapsulation layers, with each layer addressing different ingress pathways. This nested structure provides multi-barrier protection against moisture and oxygen while maintaining relatively simple overall device architecture

Inventive Principle:
Principle #7Nested doll (Nesting)

3Strength

If encapsulation filler materials are cured at elevated temperatures, then bonding strength is improved, but perovskite material decomposition is accelerated

Engineering Contradiction:
Improvebonding strengthVSAvoidcell lifespan
Core Design Contradiction:
StrengthVSDuration of action of stationary object

Solution Approach 1:

The patent changes the curing temperature parameter from elevated temperatures to low or ambient temperatures. Alternative curing mechanisms (UV light, chemical reactions) are used to achieve adequate bonding strength without the thermal energy that would accelerate perovskite decomposition, thereby extending cell lifespan

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite encapsulation materials that can achieve adequate bonding strength through non-thermal mechanisms. These composite materials are designed to provide both mechanical adhesion and chemical resistance without requiring high-temperature curing, thus protecting the perovskite material while maintaining structural integrity

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The encapsulation structure enhances the stability and prolongs the lifespan of perovskite solar cells by effectively isolating them from moisture and oxygen, maintaining high encapsulation efficiency and stability, especially for large-area cells.

Implementation Method 1

the encapsulation component is mainly formed by a first inorganic layer or organic layers and second inorganic layers that are circularly and repeatedly stacked on a first inorganic layer... effectively protecting the perovskite solar cell module, reducing damage of moisture and oxygen to the cell

Methodology Applied
Scientific EffectPermeation barrier: Permeation

Data Source

PatentEP4648584A1Packaging structure for perovskite solar cell assembly and use thereof
Publication Date: 2025.11.12 XIAN TJ-SOLAR NEW ENERGY CO LTD
  • EP4648584A1 patent drawingFigure 1
  • EP4648584A1 patent drawingFigure 2
  • EP4648584A1 patent drawingFigure 3

AI summary

The present invention belongs to the technical field of perovskite solar cells, and particularly relates to an encapsulation structure of a perovskite solar cell module and an application of an encapsulation structure of a perovskite solar cell module. The encapsulation structure includes a substrate, a transparent conductive layer, and a perovskite solar module sequentially from bottom to top, and further includes a encapsulation component in a housing structure and a encapsulation cover plate that are arranged on the transparent conductive layer. The perovskite solar module is arranged in an accommodating chamber of the encapsulation component with an inner wall in complete contact an outer wall. The encapsulation component includes a first inorganic layer, or organic layers and second inorganic layers that are circularly and repeatedly stacked on a first inorganic layer. In addition, the transparent conductive layer is composed of a left separated portion and a right separated portion, and an L-shaped metal electrode is merely in contact with a right side so as to prevent a short circuit between a first conductive portion and a second conductive portion. According to the encapsulation structure provided by the present disclosure, influence of water and oxygen on the cell can be effectively blocked through repeated sealing, thus improving stability and prolonging a service life of the cell.