Perovskite Device Segmentation for Solvent Stability

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Standard layer-by-layer solution processing methods for lead-halide perovskites constrain device architectures due to limitations in robustness to organic solvents and limited thermal budgets, leading to perovskite degradation and constraints in processing multiple perovskite layers and components.

Innovation Solution

A method involving the deposition of cations and anions on surfaces, followed by combining these surfaces under heat or pressure to form perovskite layers with specific compositions and concentration gradients, allowing for the creation of robust perovskite-containing devices with improved physical properties and performance metrics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If standard layer-by-layer solution processing methods are used to deposit perovskite layers, then the device architecture can be built sequentially, but the perovskite material degrades due to exposure to organic solvents and limited thermal processing

Engineering Contradiction:
Improvesequential processing capabilityVSAvoidperovskite stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The device is divided into two separate partial stacks that are processed independently and then combined. This segmentation allows each stack to be processed under optimized conditions without exposing the perovskite to incompatible solvents or excessive thermal budgets, thereby maintaining perovskite stability while enabling sequential manufacturing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The perovskite layers are deposited and stabilized in the first partial stack before combining with the second partial stack. This preliminary action ensures the perovskite is already formed and protected, preventing degradation during subsequent processing steps that would otherwise expose it to harmful solvents or temperatures.

Inventive Principle:
Principle #10Preliminary action

2Adaptability or versatility

If multiple perovskite layers are processed using solution methods, then device complexity and functionality increase, but processing constraints prevent successful fabrication

Engineering Contradiction:
Improvemultiple perovskite layersVSAvoidprocessing feasibility
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Multiple perovskite layers are distributed across two separate partial stacks rather than being processed sequentially in a single stack. This allows each layer to be deposited under its own optimized conditions, and the stacks are then combined to achieve the desired multi-layer functionality without processing conflicts.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The combining step acts as an intermediary process that joins the two partial stacks containing multiple perovskite layers. This intermediary step enables the integration of complex multi-layer architectures while avoiding the need to process all layers simultaneously under incompatible conditions.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If the perovskite layer is exposed to high temperatures during processing, then crystallinity and material quality improve, but the perovskite decomposes beyond the thermal budget

Engineering Contradiction:
Improveperovskite crystallinityVSAvoidthermal budget
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The thermal processing is segmented into separate steps for each partial stack, with temperature profiles optimized for each. The first partial stack receives controlled thermal treatment to achieve necessary crystallinity, while the second partial stack is processed separately and combined afterward, preventing cumulative thermal exposure that would cause decomposition.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Thermal processing to improve crystallinity is performed preliminarily on the first partial stack before combining with the second partial stack. This preliminary thermal action achieves the necessary material quality without subjecting the complete multi-layer structure to excessive cumulative heating that would cause decomposition.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the stability and performance of perovskite-containing devices by preventing degradation and enabling the use of alternative materials and architectures, such as heterojunctions and bifacial designs, with improved crystallinity and photophysical properties.

Implementation Method 1

applying at least one of heat or pressure to at least one of the first surface or the second surface resulting in at least one of the heating of the layer

Methodology Applied
Scientific EffectThermal energy: Heating

Implementation Method 2

applying at least one of heat or pressure to at least one of the first surface or the second surface resulting in at least one of the heating of the layer or the pressurizing of the layer

Methodology Applied
Scientific EffectPressure: Compression

Data Source

PatentUS11145466B2Perovskite-containing devices and methods of making the same
Publication Date: 2021.10.12 ALLIANCE FOR ENERGY INNOVATION LLC
  • US11145466B2 patent drawing
  • US11145466B2 patent drawing
  • US11145466B2 patent drawing

AI summary

The present disclosure relates to a method that includes positioning a stack that includes at least one of the following layers between a first surface and a second surface: a first perovskite layer and/or a second perovskite layer; and treating the stack for a period of time by at least one of heating the stack or pressurizing the stack, where a device that includes the first surface and the second surface provides the heating and the pressurizing of the stack.