Perpendicular Circuit Board Layout for Compact Endoscope Imaging
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Solution Overview
Problem
Conventional endoscopes have bulky image capturing assemblies, which restrict the size of the incision required for insertion, limiting the minimally invasive nature of the procedure.
Innovation Solution
The image capturing assembly features a compact design with an image sensing device mounted on a first circuit board, a second circuit board affixed perpendicular to the first, and a flexible auxiliary circuit board for electrical connections, along with a lens assembly and light emitting components, facilitating a compact and modular structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional image capturing assembly is used, then the image capturing function is achieved, but the assembly becomes bulky and increases the incision size
Solution Approach 1:
The patent transitions from a planar circuit board layout to a three-dimensional configuration by affixing the second circuit board perpendicular to the first circuit board. This spatial transformation allows electrical contacts to be arranged in different orientations, reducing the footprint of the image capturing assembly while maintaining all necessary electrical connections between the image sensing device and external components.
Solution Approach 2:
The patent divides the circuit board into two separate circuit boards (first and second) that are affixed perpendicular to each other. This segmentation allows the electrical connecting components to be distributed across different planes, reducing interference and enabling a more compact overall assembly structure that fits within smaller incision requirements.
2Volume of moving object
If the image capturing assembly is reduced in size, then minimally invasive capability is improved, but electrical connection reliability may be compromised
Solution Approach 1:
By affixing the second circuit board perpendicular to the first circuit board, the patent creates a three-dimensional electrical connection architecture. This spatial separation reduces signal interference and allows for more robust connection paths between the image sensing device electrical connecting components and the external interface, maintaining reliability while reducing the overall assembly footprint.
Solution Approach 2:
The first circuit board acts as an intermediary between the image sensing device and the second circuit board. The electrical connecting components of the image sensing device connect to first contacts on the first circuit board, which then connect to second contacts on the perpendicular second circuit board. This intermediate connection layer ensures reliable signal transmission while enabling compact packaging.
Data Source
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AI summary
An image capturing assembly(11) is provided and includes an image sensing device(111), a first circuit board(112), a second circuit board(113) and a lens assembly(114). The image sensing device(111) includes an electrical connecting component(1111). The first circuit board(112) includes a first contact(1121). The image sensing device(111) is mounted on the first circuit board(112), and the electrical connecting component(1111) is electrically connected to the first contact(1121). The second circuit board(113) includes a second contact(1131). The second circuit board(113) is affixed with the first circuit board(112) and perpendicular to the first circuit board(112), and the second contact(1131) is electrically connected to the first contact(1121), so that the second contact(1131) is electrically connected to the electrical connecting component(1111) by the first contact(1121). The lens assembly(114) is assembled with the image sensing device(111). Furthermore, a related endoscope(1) is provided.