Perpendicular Circuit Module Terminal With Voided Electrode
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing circuit modules face challenges in stabilizing electronic components perpendicular to the substrate, leading to unstable operation and reduced performance due to the configuration of electrodes and mounting methods, which limits their ability to handle broader frequency ranges and multiple bands effectively.
Innovation Solution
The circuit module design incorporates a terminal-use circuit component with electrodes that are joined perpendicularly to the substrate using a conductive joining member, omitting the center portion to prevent tilting, and optionally features voids or through-holes for additional stability, allowing the component to function as both an external connection terminal and inductor, reducing the need for additional inductors and space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the electronic component is interposed between substrates and electrodes are joined to substrates, then the electronic component is stably disposed perpendicular to the substrate, but the device complexity increases and additional support structures are required
Solution Approach 1:
The patent extracts the support function from separate substrate structures and integrates it into the terminal-use circuit component itself. The circuit component is designed to be self-supporting, eliminating the need for additional substrate-based support structures. This is achieved by having the circuit component directly dispose on the substrate with its electrodes providing both electrical connection and mechanical support.
Solution Approach 2:
The terminal-use circuit component serves multiple functions: it provides electrical connection through its electrodes, structural support for itself, and defines the inductor function. By combining these functions into a single component, the patent eliminates the need for separate support structures and additional inductors, thereby reducing device complexity while maintaining stability.
2Stability of the object's composition
If additional inductors and support structures are provided, then the stability and perpendicular disposition are improved, but the device size increases
Solution Approach 1:
The patent merges the functions of the inductor and the external connection terminal into a single terminal-use circuit component. This integration eliminates the need for separate inductor components and support structures, thereby reducing the overall device size while maintaining the required stability and perpendicular disposition of the component.
3Productivity
If the circuit component is compactly designed, then the mounting density is improved, but the operation stability deteriorates
Solution Approach 1:
The terminal-use circuit component is designed to be self-supporting, with its own structure providing the necessary stability for perpendicular disposition. The component does not require external support structures or additional components to maintain its position, thereby achieving both compact design for high mounting density and operational stability simultaneously.
Data Source
AI summary
A circuit module includes a substrate on first and second surfaces of which electronic components are mounted, sealing resins with which at least the electronic components are sealed on the first and second surfaces of the substrate, and a terminal-use circuit component at both ends of which electrodes are provided, one of the electrodes being joined by a conductive joining member to one of the first and second surfaces of the substrate such that an axis connecting centers of the electrodes at the both ends is perpendicular or substantially perpendicular to the substrate and another of the electrodes is exposed at a surface of the sealing resin, and the terminal-use circuit component includes a void at which the conductive joining member is not disposed, at a center portion of the one of the electrodes on a side coupled to the substrate.