Perpendicular Connecting Component for Low-Profile COF Splicing
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Solution Overview
Problem
Conventional mini-LED display panels face issues with display effectiveness and high risks of wiring breakage due to deformation and excessive force during splicing, leading to poor connectivity and increased risk of COF breakage.
Innovation Solution
A connecting component with a base body featuring perpendicular first and second planes, each with corresponding terminals connected by conducting wires, eliminates the need for a cavity area, minimizing protrusion thickness and enhancing signal transmission while reducing the risk of wiring breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If the PCB is disposed more to the left, then the pulling forces applied to the COF by the PCB will be less, but the thickness of the protrusion structure will increase, leading to bad display effect
Solution Approach 1:
The patent introduces a connecting component with perpendicular first and second planes, transitioning from a single-plane layout to a three-dimensional structure. This dimensional change allows the COF to be routed along the second plane perpendicular to the first plane, effectively reducing the protrusion thickness while maintaining adequate pulling force distribution.
Solution Approach 2:
The connecting component serves as an intermediary structure between the substrate and the COF. It provides a perpendicular routing path that mediates the conflict between force application and protrusion thickness, allowing the COF to be properly secured without creating excessive lateral protrusion.
2Force
If the PCB is disposed more to the right, then the pulling forces applied to the COF by the PCB will be greater, but serious deformation of the bent COF will occur, increasing risks of wiring breakage
Solution Approach 1:
By routing the COF along a perpendicular second plane instead of extending it laterally in the same plane as the substrate, the patent reduces the bending radius and deformation stress on the COF. This dimensional change allows greater pulling force to be applied without causing serious deformation or wiring breakage.
Solution Approach 2:
The patent changes the spatial orientation parameter of the COF routing from a lateral extension to a perpendicular arrangement. This parameter change in the routing geometry allows the system to tolerate higher pulling forces while maintaining COF integrity and reducing wiring breakage risks.
3Ease of manufacture
If a cavity area is maintained in the structure, then the COF can be routed, but serious deformation of bent COF caused by collision may occur during splicing processes due to overly large applied forces
Solution Approach 1:
The patent eliminates the need for a lateral cavity area by routing the COF along a perpendicular second plane. This dimensional change allows the COF to be properly routed and secured without creating a large lateral protrusion that would be susceptible to collision and deformation during splicing operations.
Solution Approach 2:
The patent extracts the COF routing from the lateral plane and relocates it to a perpendicular plane. This extraction eliminates the harmful lateral cavity area while preserving the COF routing functionality, thereby preventing deformation during splicing processes.
4Ease of operation
If the COF is bent to fix the PCB on the backplate, then the PCB can be secured, but a protrusion structure with thickness δ is generated on the lateral side of the substrate, affecting display effect
Solution Approach 1:
The patent changes the COF routing from a lateral extension that creates protrusion to a perpendicular arrangement along a second plane. This dimensional change allows the PCB to be securely fixed while eliminating the lateral protrusion structure that degrades display effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves display effectiveness by minimizing protrusion thickness and reducing wiring breakage risks, ensuring stable connectivity and enhanced performance in spliced display devices.
Implementation Method 1
each of the first terminals is connected to a corresponding second terminal by a conducting wire
Data Source
AI summary
A connecting component, a display panel, and a display device are provided. The connecting component includes a first plane and a second plane which are perpendicular to each other. The first plane is provided with a plurality of first terminals, the second plane is provided with a plurality of second terminals corresponding to the first terminals. Each of the first terminals is connected to a corresponding second terminal by a conducting wire. The connecting component may improve display effect of the display device formed by splicing the display panels, reducing risks of wiring breakage of a chip on flex (COF).