Perpendicular Connector Lead Frame for Signal Integrity

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Solution Overview

Problem

High-speed signal transmission in information handling systems is compromised due to parasitic effects caused by improper orientation of connectors on circuit board pads, leading to signal integrity issues and resonance in the communication channel.

Innovation Solution

A connector system with a lead frame having a lead portion oriented perpendicularly to first and second mounting portions, which extend in substantially opposite directions, to prevent the creation of open signal transmission paths that can act as resonators, ensuring reliable high-speed signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If connectors are mounted to connector pads in conventional orientations, then manufacturing is simplified and connector installation is easier, but signal integrity is compromised due to parasitic effects and resonance at high data transmission speeds

Engineering Contradiction:
Improvesignal integrityVSAvoidconnector orientation requirements
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The connector pad is designed with an asymmetric layout where the first connector pad and second connector pad are positioned at different locations and orientations relative to the signal transmission line. This asymmetric configuration eliminates the formation of open signal transmission paths that would create resonant circuits, thereby improving signal integrity while maintaining manufacturing simplicity through standardized pad structures.

Inventive Principle:
Principle #4Asymmetry

2Reliability

If connector pads are designed with specific orientation requirements to prevent resonance, then signal integrity is improved, but manufacturing complexity and installation difficulty increase

Engineering Contradiction:
Improvesignal integrityVSAvoidconnector pad manufacturing
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The connector assembly is designed with universal mounting portions that can be attached to differently oriented connector pads without requiring different connector designs. The first mounting portion and second mounting portion are configured to accommodate various pad orientations, allowing the same connector to be used across different signal transmission configurations while maintaining signal integrity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If connectors are mounted without regard to orientation, then installation is easier and manufacturing is simpler, but parasitic effects create resonance that increases energy loss

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidsignal energy loss
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The signal transmission path is optimized locally at the connector pad interface by positioning the first connector pad and second connector pad at specific locations relative to the signal transmission line. This local optimization prevents the creation of open circuits that would form resonant circuits, thereby reducing parasitic effects and energy loss without requiring changes to the overall connector design or manufacturing process.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances signal integrity by eliminating resonance and reducing insertion losses, allowing for efficient high-speed data transmission without regard to the connector pad orientation, while also reducing the area needed for the connector pad and improving manufacturing efficiency.

Implementation Method 1

that may act as a resonator (e.g., at quarter wavelengths) that can compromise the signal integrity

Methodology Applied
Scientific EffectResonance: Resonance

Data Source

PatentUS10862232B2Circuit board pad connector system
Publication Date: 2020.12.08 DELL PROD LP
  • US10862232B2 patent drawing
  • US10862232B2 patent drawing
  • US10862232B2 patent drawing

AI summary

A circuit board pad connector system includes a connector that is configured to mount to a connector pad that is included on a circuit board. The connector includes a connector lead frame. A lead portion is provided on the connector lead frame such that the lead portion is oriented substantially perpendicularly relative to the connector pad when the connector is mounted to the connector pad. A first mounting portion is provided on the connector lead frame, is configured to mount the connector to the connector pad, and extends in a first direction that is substantially perpendicular relative to the lead portion. A second mounting portion is provided on the connector lead frame, is configured to mount the connector to the connector pad, and extends in a second direction that is different than the first direction and that is substantially perpendicular relative to the lead portion.