Perpendicular Die Stack Assembly for Heat and Signal Routing
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Solution Overview
Problem
Traditional semiconductor device assemblies face challenges with heat dissipation and limited device connectivity due to stacked devices that require large thermal conduits and parallel interconnections, restricting their application to specific types of devices.
Innovation Solution
Implementing perpendicular semiconductor device stacks that allow direct heat dissipation from the top of the assembly and enable direct connections between each stack device and the assembly, using communication elements like inductors or optical elements for signaling without conductive bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional stacked semiconductor devices are used with parallel interconnections, then device connectivity is achieved, but heat dissipation becomes problematic requiring large thermal conduits
Solution Approach 1:
The patent transitions from traditional parallel interconnections to perpendicular interconnections, changing the dimensional orientation of signal and power pathways. This allows thermal conduits to be positioned vertically through the stack rather than laterally, significantly reducing the horizontal space required for thermal management while maintaining effective heat dissipation from each device layer.
2Adaptability or versatility
If traditional stacked devices with parallel interconnections are used, then device assembly is achieved, but device versatility is limited to specific types
Solution Approach 1:
The perpendicular interconnection structure serves multiple functions simultaneously: it provides signal transmission, power delivery, and thermal management pathways in a unified architecture. This multi-functional design enables compatibility with various device types including logic devices, memory devices, and sensors within the same stack, enhancing versatility while managing complexity through integration.
3Quantity of substance
If more semiconductor devices are stacked to increase capacity, then device density increases, but heat dissipation challenges worsen
Solution Approach 1:
The patent implements segmented thermal management by providing individual thermal conduits for each semiconductor device layer rather than a single consolidated thermal path. This segmentation allows heat to be extracted from each device independently and efficiently, preventing heat accumulation in multi-device stacks and enabling higher device density without compromising thermal performance.
Data Source
AI summary
A semiconductor device assembly can include an assembly semiconductor die having a top surface with a first and a second assembly communication element thereat. The semiconductor device assembly can further include a semiconductor die stack coupled to the top surface. The die stack can include a first and a second semiconductor die, each having a top surface perpendicular to the top surface of the assembly semiconductor die. Further, the first semiconductor die can have a first die communication element aligned with and configured to directly communicate with the first assembly communication element, and the second semiconductor die can have a second die communication element aligned with and configured to directly communicate with the second assembly communication element.