Perpendicular Electrode Micro-LED Display for High-Resolution Transfer
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Solution Overview
Problem
The productivity of display devices using micro-semiconductor chips decreases as chip sizes shrink and device sizes increase, due to limitations in transfer technologies and repair processes for micro-sized light-emitting devices.
Innovation Solution
A display device with a perpendicular electrode structure is developed, featuring a display substrate with grooves for micro-semiconductor chips, where the chips include n-type and p-type semiconductor layers, and electrodes connected through via holes, allowing for accurate and efficient electrode connection without bonding processes, and enabling operation without repair when chips are omitted.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If micro-semiconductor chips are used to manufacture high-resolution display devices, then display resolution is improved, but productivity decreases due to limitations in transfer technologies and repair processes
Solution Approach 1:
The patent transitions from planar electrode connections to three-dimensional vertical connections by forming via holes through the substrate and extending electrodes vertically to contact semiconductor layers at different depths. This dimensional change enables accurate electrode connections without complex bonding processes, thereby improving productivity while maintaining high display resolution
Solution Approach 2:
The patent performs preliminary actions by pre-forming via holes and extending electrodes before transferring micro-semiconductor chips. This preliminary preparation of the substrate structure with vertical electrode paths enables efficient chip integration and eliminates the need for complex post-transfer bonding processes, thus improving productivity
2Ease of manufacture
If micro-semiconductor chips are transferred using conventional methods, then chip placement is achieved, but the process becomes complex and time-consuming
Solution Approach 1:
The patent simplifies chip placement by implementing vertical electrode connections through via holes, eliminating the need for complex planar alignment and bonding processes. The vertical electrode structure allows for more straightforward chip integration, reducing both process complexity and time requirements
3Reliability
If conventional electrode connection methods are used, then electrical connection is achieved, but bonding processes are required which reduce productivity
Solution Approach 1:
The patent replaces mechanical bonding processes with direct vertical electrical contact through etched via holes and extending electrodes. This substitution eliminates the need for separate bonding steps while maintaining reliable electrical connections, thereby significantly improving productivity without compromising connection reliability
Data Source
AI summary
A display device and a method of manufacturing the display device are provided. The display device includes a display substrate including a driving circuit; an array layer provided on the display substrate and including a plurality of grooves; a micro-semiconductor chip provided in a groove of the plurality of grooves, the micro-semiconductor chip including: an n-type semiconductor layer; an active layer provided on the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; and a first electrode provided on the p-type semiconductor layer; and a second electrode connected to the n-type semiconductor layer from a lower surface of the display substrate; a first wiring connected to the first electrode; and a second wiring connected to the second electrode.