Perpendicular Emission Measurement Device for Semiconductor Package Thickness
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Solution Overview
Problem
Conventional measurement devices face challenges in accurately measuring the vertical thickness and refractive index of semiconductor package molds due to process dispersion and variations in refractive indices across different portions, leading to measurement errors and potential manufacturing issues.
Innovation Solution
A measurement device that emits electromagnetic signals in a direction substantially perpendicular to the surface of the semiconductor package, using a splitter to reflect and transmit signals, and detectors to measure reflection and transmission times, allowing for real-time calculation of refractive index and thickness, while moving relative to the package to account for position-dependent variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional measurement devices measure mold thickness and refractive index, then measurement data is obtained, but measurement errors occur due to process dispersion and refractive index variations across different portions
Solution Approach 1:
The measurement device divides the mold into multiple measurement portions and performs separate measurements on each portion. By segmenting the measurement process and analyzing refractive index variations across different portions, the device identifies and compensates for process dispersion effects, thereby improving measurement accuracy and reliability simultaneously
Solution Approach 2:
The measurement device changes measurement parameters by measuring both thickness and refractive index at multiple portions of the mold. By varying the measurement location and using these parameter changes across different portions, the device calculates corrected values that account for process dispersion, resolving the contradiction between measurement precision and reliability
2Productivity
If electromagnetic signals are emitted at an angle to measure mold properties, then measurement can be performed, but measurement errors increase due to position-dependent refractive index variations
Solution Approach 1:
The measurement device emits electromagnetic signals perpendicular to the mold surface, creating equipotential measurement conditions. This perpendicular emission direction eliminates position-dependent refractive index variations that would otherwise occur with angled measurements, maintaining measurement accuracy while preserving measurement efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces measurement errors from process dispersion, providing accurate and precise vertical thickness measurements with reduced errors from about 20-30 μm to 2-3 μm, enhancing the reliability of semiconductor package manufacturing by accounting for refractive index variations across different regions.
Implementation Method 1
A first detector is disposed to measure a first portion of the electromagnetic signal reflected by the semiconductor package
Implementation Method 2
A second detector is disposed to measure a second portion of the electromagnetic signal transmitted through the semiconductor package
Data Source
AI summary
A measurement device includes an emitter configured to emit an electromagnetic signal to an object to be measured. A first detector is disposed to measure a first portion of the electromagnetic signal that is reflected by the object to be measured. A second detector is disposed to measure a second portion of the electromagnetic signal that is transmitted through the object to be measured. The emitter is configured to emit the electromagnetic signal in a direction substantially perpendicular to a surface of the object to be measured.