Perpendicular RF Card Antenna Array via Ball Grid Array
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Solution Overview
Problem
Existing antenna arrays require extensive manual assembly and use expensive, heavy discrete components like baluns, cables, and connectors to transfer energy, which increases weight and assembly complexity.
Innovation Solution
The antenna array design features a substrate circuit board with perpendicular radio frequency circuit boards connected via ball grid array technology, eliminating the need for discrete connectors and allowing for automated assembly, reducing weight and cost while supporting ultra-wideband operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components such as baluns, cables, and connectors are used to transfer energy, then energy transfer function is achieved, but weight and device complexity increase
Solution Approach 1:
The patent integrates the energy transfer function directly into the circuit board structure by creating conductive pathways through vias and trace patterns on the PCB. This merges previously separate discrete components (baluns, cables, connectors) into a unified planar transmission structure, eliminating the need for heavy three-dimensional discrete components while maintaining the energy transfer function.
Solution Approach 2:
The patent extracts and eliminates the discrete components (baluns, cables, connectors) from the antenna array structure. By removing these separate energy transfer components and replacing them with integrated PCB trace pathways, the design reduces weight and complexity while preserving the essential energy transfer capability from feed points to antenna elements.
2Reliability
If discrete components such as baluns, cables, and connectors are used to transfer energy, then energy transfer function is achieved, but device complexity and assembly labor increase
Solution Approach 1:
The patent combines multiple discrete components into a single integrated PCB structure. The energy transfer function is achieved through trace patterns and via connections printed/cured on the circuit board itself, merging what were previously separate baluns, cables, and connectors into one monolithic planar structure, thereby reducing assembly complexity.
Solution Approach 2:
The patent removes discrete energy transfer components from the assembly. By extracting baluns, cables, and connectors and replacing them with integrated PCB trace pathways, the design eliminates the complexity of connecting multiple separate components, reducing both device complexity and assembly labor requirements.
3Ease of operation
If manual assembly is used for connection components, then assembly flexibility is maintained, but productivity and manufacturing precision decrease
Solution Approach 1:
The patent extracts connection components from manual assembly processes. By integrating energy transfer pathways directly into the PCB structure through printed traces and vias, the design eliminates the need for manual connection of discrete components, enabling automated PCB manufacturing processes that significantly increase productivity while maintaining consistent manufacturing precision.
Solution Approach 2:
The patent replaces mechanical assembly operations with automated PCB manufacturing processes. Instead of manually connecting discrete components, the energy transfer pathways are created through automated printing, etching, and via formation processes during PCB fabrication, substituting manual mechanical assembly with automated manufacturing that achieves higher productivity and precision.
4Reliability
If discrete components are used behind the aperture, then energy transfer is achieved, but cost increases
Solution Approach 1:
The patent merges discrete energy transfer components into a single integrated PCB structure. By combining baluns, cables, and connectors into one planar transmission system printed on the circuit board, the design reduces component count and assembly operations, thereby lowering manufacturing costs while maintaining the energy transfer function.
Solution Approach 2:
The patent removes expensive discrete components (baluns, cables, connectors) from the antenna array. By extracting these high-cost items and replacing them with low-cost PCB trace pathways and via connections, the design significantly reduces bill of materials cost and assembly cost while preserving the essential energy transfer capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient, lightweight, and cost-effective assembly of ultra-wideband antenna arrays with reduced assembly errors, supporting multifunctional and multiband operations, and is scalable for increased aperture area and frequency compatibility.
Implementation Method 1
Each of the circuit board cards are coupled to a respective signal pad via a respective solder connection and attached to the top surface at the respective signal pad via the respective solder connection
Implementation Method 2
The antenna system includes a back plane circuit board having a top surface, first radio frequency circuit boards on the back plane circuit board and perpendicular to the top surface, and second radio frequency circuit boards on the back plane circuit board and perpendicular to the top surface. The method includes making a connection using ball grid array technology between the top surface of the back plane circuit board and the first and second radio frequency circuit boards
Data Source
AI summary
An antenna array and a method of making can use solder connections. The antenna system includes a back plane circuit board having a top surface, first radio frequency circuit boards arranged in rows on the back plane circuit board and perpendicular to the top surface, and second radio frequency circuit boards arranged in columns on the back plane circuit board and perpendicular to the top surface. Each of the first radio frequency circuit boards include at least one first antenna element, and each of the second radio frequency circuit boards include at least one second antenna. The first radio frequency circuit boards and second radio frequency circuit boards are connected to the back plane circuit board by solder connections.