Perpendicular Semiconductor Module Layout for Signal Speed
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Solution Overview
Problem
Current semiconductor technologies face challenges in enhancing the performance and integration density of semiconductor devices due to limitations in signal transmission speed and cooling efficiency, particularly in reducing the physical distance between logic and memory devices, which complicates impedance matching and affects overall system performance.
Innovation Solution
A semiconductor module design that includes a module substrate with a logic device and memory devices disposed perpendicular to each other, supported by a supporter, which reduces signal transmission paths and enhances cooling efficiency by optimizing the physical layout and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If memory devices are disposed perpendicular to the logic device on the module substrate, then signal transmission path is reduced and data processing speed is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent transitions from a conventional planar arrangement where memory devices are disposed parallel to the logic device to a three-dimensional perpendicular arrangement. Memory devices are mounted vertically on the module substrate, extending in the thickness direction, while the logic device remains on the surface. This dimensional change reduces the signal transmission path from a lateral route to a direct vertical connection, significantly improving signal transmission speed while managing device complexity through standardized mounting structures.
2Speed
If the physical distance between logic device and memory device is reduced, then signal transmission speed is improved, but impedance matching becomes more difficult and affects system performance
Solution Approach 1:
The patent introduces a module substrate as an intermediary structure that facilitates the perpendicular mounting of memory devices. The substrate includes through-holes with conductive structures that serve as intermediaries for signal transmission between the logic device and vertically mounted memory devices. This intermediary structure enables precise impedance control and matching by providing dedicated signal paths and transmission lines embedded in the substrate, thereby maintaining signal integrity despite the reduced physical distance and three-dimensional arrangement.
3Quantity of substance
If memory devices are disposed perpendicular to the logic device, then integration density is improved, but cooling efficiency and thermal management become more challenging
Solution Approach 1:
The patent segments the module substrate into distinct functional regions: a first surface for mounting the logic device, a second surface for mounting memory devices, and side surfaces for heat dissipation. The perpendicular arrangement of memory devices on the second surface, combined with exposed side surfaces, creates multiple thermal pathways. This segmentation allows heat to be dissipated from multiple directions (top, bottom, and sides), improving cooling efficiency while maintaining high integration density through the three-dimensional configuration.
Data Source
AI summary
A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module.