Segmented Cooling Assembly for PET Detector Modules
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Solution Overview
Problem
Current PET detector assemblies face challenges with cooling efficiency due to integrated cooling plates, which hinder the ability to maintain stable temperatures and efficiently cool detecting modules and electronics, making it difficult to disassemble and repair the detecting cells.
Innovation Solution
A detector apparatus with a cooling assembly comprising two thermally connected layers, where one layer is connected to the detecting module and the other to the electronics module, allowing for independent cooling and temperature management, and including thermally insulating layers to prevent heat exchange between the layers, with adjustable configurations for improved efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If an integrated cooling plate is used to cool the detecting cells, then the cooling structure is simple, but the cooling efficiency decreases and the detecting cells cannot be easily disassembled for repair
Solution Approach 1:
The integrated cooling plate is divided into multiple independent cooling plates, each capable of cooling specific detecting cells. This segmentation allows individual cooling plates to be removed and replaced without affecting the entire system, improving both cooling efficiency and ease of repair while maintaining structural simplicity through modular design
2Device complexity
If an integrated cooling plate is used to cool the detecting cells, then the cooling structure is simple, but the detecting cells become difficult to disassemble and repair
Solution Approach 1:
The cooling system is segmented into independent cooling plates that can be individually removed. This allows detecting cells to be accessed and repaired without removing the entire cooling structure, significantly improving ease of repair while keeping each individual cooling plate structurally simple
3Device complexity
If a single cooling plate cools both detecting module and electronics module, then the device complexity is low, but the temperature control precision decreases
Solution Approach 1:
The single cooling plate is segmented into multiple independent cooling plates, each dedicated to cooling specific components (detecting module or electronics module). This allows independent temperature control for each module, improving temperature stability while maintaining low device complexity through straightforward modular construction
Solution Approach 2:
Each cooling plate is designed with specific local cooling capabilities tailored to its designated component. This local quality approach ensures optimal temperature control for each module without requiring complex integrated systems, achieving precise temperature management through simple dedicated designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency, maintains a stable temperature gradient, and allows for easier maintenance and repair by enabling detachable detecting cells, improving the overall performance of the PET imaging system.
Implementation Method 1
The cooling assembly may include a first layer and a second layer. The first layer may be thermally connected with the detecting module, and the second layer may be thermally connected with the electronics module
Implementation Method 2
The cooling assembly may further include one or more thermally insulating layers mounted between the first layer and the second layer
Data Source
AI summary
The present disclosure relates to a detector apparatus. The detector apparatus may include a detecting module, an electronics module and a cooling assembly. The detecting module may be configured to detect radiation rays emitted from a subject and generate electrical signals in response to detection of radiation rays. The electronics module may be configured to process the electrical signals generated by the detecting module. The cooling assembly may be configured to cool the detecting module and the electronics module. The cooling assembly may include a first layer and a second layer. The first layer may be thermally connected with the detecting module, and the second layer may be thermally connected with the electronics module.