Rubber-Embedded Electronic Assembly With PET-to-Rubber Adhesion
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Solution Overview
Problem
The integration of electronic devices, such as RFID tags, into rubber articles like tires faces challenges due to inadequate adhesion between insulating layers and rubber, leading to potential device failure and damage to the tire's rubber surface.
Innovation Solution
A method involving a deposition of an adhesive solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde, followed by a heating process, is applied to the thermoplastic layers to ensure strong adhesion between the electronic elements and the rubber layers, using a sandwich-like structure with thermoplastic and rubber layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If insulating PET layers are used to contain electronic elements, then the electronic device structure is formed, but the adhesion between insulating layers and rubber layers is insufficient leading to device splitting
Solution Approach 1:
The patent applies a primer layer to the rubber layers before assembling the electronic device. This preliminary action prepares the rubber surface by creating a bonding interface that enhances adhesion between the rubber and insulating PET layers, preventing device splitting during subsequent operations.
Solution Approach 2:
The primer layer acts as an intermediary substance between the rubber layers and insulating PET layers. This intermediate layer facilitates bonding between the two materials, resolving the adhesion problem by providing a compatible interface that both rubber and PET can bond to effectively.
2Ease of manufacture
If insulating layers are not correctly adhered to rubber layers, then manufacturing is simpler, but the RFID device and surrounding rubber can be damaged
Solution Approach 1:
The primer layer is applied during the manufacturing process before final assembly, ensuring proper adhesion is established upfront. This preliminary bonding action prevents reliability issues later without significantly complicating the manufacturing workflow, as the primer application is a straightforward step integrated into the assembly process.
3Ease of operation
If insulating layers are not properly adhered, then assembly is easier, but cuts and cracks can occur in the surrounding rubber
Solution Approach 1:
By applying the primer layer before assembly, the bonding interface is prepared in advance. This ensures that when components are assembled, they remain securely bonded, preventing rubber damage from layer separation or movement during operation, while maintaining ease of assembly.
Solution Approach 2:
The primer layer provides beforehand cushioning by creating a protective bonding interface that prevents harmful effects (rubber cuts and cracks) from occurring. This preventive measure ensures that even if stress or movement occurs during operation, the bonded structure resists separation and protects the rubber from damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a strong and stable adhesion, preventing device splitting and damage to the tire's rubber, as demonstrated by increased adhesion force values in adhesion tests, thereby ensuring the correct operation of the electronic devices within the tire.
Implementation Method 1
an adhesive solution consisting of a basic water solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde is applied on at least one outer surface of one of the layers of thermoplastic material
Implementation Method 2
a heating operation, during which the layers of thermoplastic material on which the adhesive solution was applied are kept at a temperature ranging from 120 to 230° C. for an amount of time ranging from 2 to 15 min
Data Source
AI summary
A method to manufacture an electronic device to be applied to rubber article. The device comprises an electronic element, two layers of thermoplastic material which are arranged in a sandwich-like manner so as to contain, between one another, the electronic element, and at least an outer rubber layer arranged to cover an outer surface of at least one of the respective thermoplastic layers. The method comprises a preliminary step comprising (a) a deposition operation, during which an adhesive solution consisting of a basic water solution comprising a latex of an elastomer rubber and a combination of resorcinol and formaldehyde is applied on at least one outer surface of one of the layers of thermoplastic material; and (b) a heating operation, during which the layers of thermoplastic material on which the adhesive solution was applied are kept at a temperature ranging from 120 to 230° C. for an amount of time ranging from 2 to 15 min.