PET Substrate Via Formation for Transparent Touch Panel Connections
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Solution Overview
Problem
Existing touch position-sensing technologies face challenges in forming reliable electrical connections between conductive patterns on insulating substrates and external circuits, particularly in ensuring secure and efficient routing of conductive tracks while maintaining transparency and minimizing physical and environmental damage.
Innovation Solution
The use of a pulsed laser to selectively remove material from PET substrates, creating vias and conductive connections between conductive pads on opposite faces, allowing for flexible routing and encapsulation of electrodes to protect against damage, while maintaining transparency and efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods (drilling, punching, UV laser) are used to form vias through PET substrates, then electrical connections between conductive patterns on opposite faces can be established, but the substrate and conductive patterns suffer physical and environmental damage reducing reliability
Solution Approach 1:
The patent extracts and removes the PET substrate material selectively at via locations using oxygen plasma treatment followed by oxygen reactive ion etching, eliminating the need to force conductive material through damaged substrate. This extraction approach removes harmful physical damage while establishing clean pathways for electrical connections.
Solution Approach 2:
The patent replaces mechanical drilling and punching methods with a chemical etching process using oxygen plasma and reactive ion etching. This substitution eliminates mechanical stress and physical damage to the substrate and conductive patterns, achieving via formation through controlled material removal rather than forceful penetration.
2Reliability
If conductive material is forced through damaged vias to create electrical connections, then connectivity is achieved, but the connection quality and durability are compromised
Solution Approach 1:
The patent performs preliminary oxygen plasma treatment and oxygen reactive ion etching to create clean, well-defined via pathways before introducing conductive material. This preliminary preparation ensures that conductive material can be deposited onto intact substrate surfaces and form strong, durable connections without the weakness caused by forced insertion through damaged material.
Solution Approach 2:
The patent introduces oxygen plasma and oxygen reactive ion etching as intermediary processes between substrate preparation and conductive material deposition. These intermediary steps create optimally prepared via surfaces that facilitate strong adhesion and reliable electrical connections, acting as a bridge between the substrate and conductive material.
3Strength
If rigid substrate structures are used to maintain structural integrity, then durability is improved, but flexibility in routing conductive tracks and accommodating external circuits is reduced
Solution Approach 1:
The patent changes the physical and chemical parameters of the PET substrate surface through oxygen plasma treatment and controlled etching, creating regions with modified surface energy and morphology. These parameter changes enable the substrate to maintain overall structural integrity while providing localized areas that facilitate flexible routing and reliable connections to external circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of reliable and flexible electrical connections between conductive patterns and external circuits, enhancing the transparency and durability of touch position-sensing panels, thereby improving the functionality and reliability of touch-sensitive displays.
Implementation Method 1
The use of a pulsed laser to selectively remove material from PET substrates, creating vias and conductive connections between conductive pads on opposite faces
Data Source
AI summary
Insulating substrates may be selectively removed to form electrical connections between conductive patterns on different faces of the insulating substrate or between conductive patterns on the insulating substrate and external circuits.