PFC Module Cooling Plate Layout for Compact Power Conversion
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Solution Overview
Problem
Existing power conversion devices face challenges in miniaturization due to heat radiation inefficiencies, particularly with power semiconductors generating high heat, which can lead to adverse effects such as capacitor deterioration and increased power loss.
Innovation Solution
A power conversion device design featuring a housing with a horizontal flow path for coolant, a detachable power factor correction circuit module with a cooling plate, power semiconductor, electrolytic capacitor, and resin mold, allowing for efficient heat exchange and modularization to reduce height, thereby enhancing miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power conversion is performed on power of large current or high voltage, then power conversion capability is improved, but power loss and heat generation from power semiconductor increase
Solution Approach 1:
The patent converts the harmful heat generated by power semiconductors during high-power conversion into a beneficial cooling effect by directing coolant flow through strategically designed flow paths that utilize the heat source location to maximize cooling efficiency while minimizing energy loss
2Power
If power conversion is performed on power of large current or high voltage, then power conversion capability is improved, but heat generation from power semiconductor increases causing adverse effects
Solution Approach 1:
The patent extracts the heat generated by power semiconductors from the system by implementing dedicated cooling channels that isolate and remove thermal energy before it can affect surrounding components such as capacitors, thereby preventing heat-related deterioration
Solution Approach 2:
The patent introduces coolant as an intermediary substance that absorbs heat from power semiconductors through thermally conductive paths and transports it away from sensitive components, acting as a thermal buffer between heat sources and heat-sensitive elements
3Temperature
If liquid-cooled type heat radiation method is used with vertical branching flow path, then cooling capability is improved, but refrigerant stagnation occurs and heat dissipation efficiency decreases
Solution Approach 1:
The patent transitions from vertical branching flow paths to horizontal planar flow paths, changing the dimensional orientation of coolant flow to eliminate stagnation zones while maintaining effective heat transfer surfaces, thereby improving both cooling capability and heat dissipation efficiency
4Volume of moving object
If power semiconductor and capacitor are arranged close together for miniaturization, then device size is reduced, but heat affects capacitor causing deterioration
Solution Approach 1:
The patent introduces coolant flow paths as thermal intermediaries between power semiconductors and capacitors, allowing close spatial arrangement for miniaturization while the coolant actively removes heat before it can reach the capacitor, maintaining both compact size and component reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat from power semiconductors, reduces radiation effects on surrounding components, and achieves a more compact device structure without compromising performance.
Implementation Method 1
a cooling plate having thermal conductivity and formed in a flat plate shape
Implementation Method 2
a flow path running in one plane is formed
Data Source
AI summary
A power conversion device includes a power factor correction circuit includes: a power semiconductor having a heat radiation surface facing a first principal surface of a cooling plate, fixed to the first principal surface so as to exchange heat with the cooling plate, and electrically connected to a drive board; an electrolytic capacitor disposed on an opposite side of the power semiconductor from the cooling plate and a same side of the power semiconductor as the drive board, and electrically connected to the drive board; and a resin mold that is fixed to the first principal surface of the cooling plate, defines a position of the power semiconductor, and is interposed at least between the power semiconductor and the electrolytic capacitor. A second principal surface of the cooling plate is thermally connected to a housing when the power factor correction circuit module is fixed to the housing.