Power Factor Correction Module Layout for Better Heat Dissipation
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Solution Overview
Problem
The heat dissipation problem in high integration/high power density power modules is a significant barrier to the development of advanced power module technologies, particularly in devices requiring efficient energy conversion.
Innovation Solution
A power factor correction device with a converter housing and substrates designed for improved heat dissipation, featuring a second converter substrate with a large source pad and an air layer for rapid heat dissipation, along with strategically positioned heat dissipation pads and pads of varying thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high integration/high power density is adopted in power modules, then energy conversion efficiency is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The second converter substrate is divided into distinct functional regions: a first region with a source pad for mounting power semiconductor elements, and a second region with a heat dissipation pad for heat dissipation. This segmentation allows simultaneous optimization of power handling and thermal management in different areas of the same substrate.
Solution Approach 2:
Different regions of the second converter substrate are designed with different thermal conductivities: the first region (source pad area) has higher thermal conductivity for efficient heat transfer from power elements, while the second region (heat dissipation pad area) is optimized for heat dissipation to the housing. This local quality differentiation enables targeted thermal management.
2Temperature
If heat dissipation pad area is increased, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The second converter substrate serves multiple functions simultaneously: it acts as an electrical connection substrate for power semiconductor elements, a heat dissipation substrate for thermal management, and a mounting substrate for various pads. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby reducing overall device complexity.
Solution Approach 2:
The heat dissipation function is merged into the converter substrate itself rather than requiring a separate heat sink or heat dissipation component. The heat dissipation pad is integrated directly onto the second converter substrate, combining electrical and thermal management functions in a single component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device efficiently reduces the overall temperature of the power module by rapidly spreading heat to an air layer and a wide source pad, enhancing heat dissipation and reducing temperature.
Implementation Method 1
a heat dissipation pad for dissipating heat transferred to the source pad and the drain pad to the outside
Implementation Method 2
an air layer may be formed between the second region and the housing cover
Data Source
Figure 1~2
Figure 3
Figure 4(a)~4(b)
AI summary
A device for power factor correction can include a converter housing having an inner surface; a first converter substrate mounted on the inner surface of the converter housing; a second converter substrate mounted on another surface of first converter housing opposite to the inner surface; and a housing cover covering the first converter substrate and coupled to an upper surface of the converter housing, in which the second converter substrate includes a first surface having a first region including a source pad, and a second region including a drain pad spaced apart from the source pad, the source pad including a source pad extension portion extending into the second region; and a second surface including a heat dissipation pad for communicating heat from the source and drain pads to an outside of the device, in which the first region of the second converter substrate overlaps with the another surface of first converter housing, and the second region of the second converter substrate faces the housing cover without overlapping with the first converter substrate.