Phase-Change Heat Dissipation Module for High-Power Antennas
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Solution Overview
Problem
Existing heat dissipation systems in electronic devices, particularly antenna apparatuses, face challenges in managing increased heat generation due to high-power RF components, leading to weight and volume increases, which hinder the reduction of electronic device size and weight, and are limited by the thermal conductivity of materials.
Innovation Solution
A heat dissipation device and module that includes heat receiving parts coupled through a heat transfer member with fixed slits and a shielding cover, sealed with a brazing welding method, using phase-changeable refrigerant to enhance heat exchange and prevent weight increase, while allowing for various heat dissipation structures and improved productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power RF components are used to increase transmission power for coverage expansion, then transmission power is improved, but heat generation increases leading to weight and volume increase of heat dissipation devices
Solution Approach 1:
The patent utilizes phase-changeable refrigerant (liquid-gas phase transition) within the heat transfer member to enable efficient heat absorption and transport. The refrigerant changes phase from liquid to gas in the heating portion, absorbs latent heat, then condenses back to liquid in the cooling portion, releasing heat. This phase transition mechanism allows high-power heat dissipation without requiring large or heavy heat dissipation structures.
2Reliability
If heat dissipation surface area is increased to overcome material thermal conductivity limitations, then heat dissipation performance is improved, but device volume and weight increase
Solution Approach 1:
The patent employs phase-changeable refrigerant that undergoes liquid-gas transition to dramatically enhance heat transfer efficiency. The latent heat of vaporization and condensation provides intensive heat exchange without requiring large surface areas, thus maintaining compact device volume while achieving superior heat dissipation performance.
Solution Approach 2:
The patent changes the thermal state parameters of the refrigerant (temperature, pressure, phase) to optimize heat transfer. By controlling the phase transition conditions and utilizing the refrigerant's thermodynamic properties, the system achieves high heat dissipation efficiency in a compact form factor.
3Reliability
If complex heat dissipation structures are designed to improve heat dissipation performance, then heat dissipation performance is improved, but manufacturing complexity and productivity decrease
Solution Approach 1:
The heat transfer member is divided into functionally distinct segments: a heating portion that contacts the heat-generating component, a refrigerant-filled intermediate section where phase change occurs, and a cooling portion that dissipates heat. This segmentation allows each part to be optimized independently while simplifying the overall manufacturing process through modular assembly.
Solution Approach 2:
The patent integrates multiple functions into a single heat transfer member: heat absorption, refrigerant phase change, heat transport, and heat dissipation all occur within one unified component. This merging reduces the number of separate parts and assembly steps, thereby improving manufacturing productivity while maintaining high heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from electronic devices, preventing weight and size increases, overcoming material conductivity limitations, and improving on-site workability and productivity through a simple coupling process.
Implementation Method 1
using phase-changeable refrigerant to enhance heat exchange
Implementation Method 2
a heat transfer member for coupling formed with a plurality of fixed slits into which a part of at least one of the heat receiving parts is inserted
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
Provided are a heat dissipation device, a heat dissipation module, and an antenna apparatus including the same. The heat dissipation device includes heat receiving parts that collect heat generated from heating substances, and a heat discharging part that exchanges heat collected from the heating substances with outside air, wherein at least one of the heat receiving parts is coupled through a heat collection part, and is coupled to a housing body provided with the heating substances. The heat collection part includes: a heat transfer member for coupling formed with a plurality of fixed slits into which a part of at least one of the heat receiving parts is inserted; and a shielding cover coupled to the heat transfer member for coupling to form a predetermined refrigerant-filled space therein, and sealing the refrigerant-filled space.