Phase-Change Chamber With Patterned Surfaces for Electronic Cooling
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Solution Overview
Problem
Existing heat dissipation techniques for electronic devices are inefficient due to large equipment requirements and multiple thermal interfaces that hinder effective heat transfer, leading to high internal temperatures and potential premature device failure.
Innovation Solution
A phase-change chamber with a patterned surface capable of transitioning between phases, featuring high and low affinity regions to the phase-change medium, and supporting members for structural integrity, which enhances heat transfer by facilitating evaporation and condensation within the chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If natural thermal convection is used for heat dissipation, then no additional equipment is required, but heat transfer efficiency is poor and internal temperature rises high
Solution Approach 1:
The patent employs phase change material (PCM) that transitions between solid and liquid phases to absorb and store thermal energy. The PCM undergoes phase transition at a specific temperature, absorbing large amounts of latent heat during melting and releasing it during solidification, thereby significantly improving heat transfer efficiency compared to natural convection alone
Solution Approach 2:
The patent utilizes a porous substrate structure to hold the phase change material. The porous structure increases the surface area for heat transfer, facilitates capillary action for fluid circulation, and enhances thermal contact between the PCM and the heat-generating electronic components, thereby improving overall heat dissipation performance
2Productivity
If heat sink with fins is used to maximize heat exchange surface area, then heat dissipation capability is improved, but equipment size and weight increase
Solution Approach 1:
The phase change material provides high latent heat storage capacity in a compact form factor. During phase transition, the PCM absorbs or releases large amounts of heat without significant temperature change, enabling efficient heat dissipation in a much smaller and lighter package compared to traditional finned heat sinks that rely on large surface areas
Solution Approach 2:
The patent changes the thermal management approach from conductive/convective heat transfer in traditional heat sinks to phase change heat storage and release. This parameter change in the heat transfer mechanism allows for compact design while maintaining high heat dissipation capability through the high latent heat of the PCM
3Reliability
If multiple thermal interface materials are used to connect electronic device to heat sink, then thermal connection is improved, but the multiple interfaces hinder effective heat transfer
Solution Approach 1:
The patent combines the thermal interface function and the heat storage/dissipation function into a single integrated phase change material system. The PCM directly contacts both the heat-generating electronic components and the heat sink structure, eliminating the need for multiple separate thermal interface materials and reducing the number of thermal interfaces while maintaining or improving heat transfer effectiveness
Solution Approach 2:
The phase change material serves multiple functions simultaneously: it acts as a thermal interface material filling gaps between components, as a heat storage medium during phase transition, and as a heat transfer medium connecting to the heat sink. This multi-functionality reduces system complexity by consolidating what would otherwise require multiple separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The phase-change chamber effectively transfers heat from electronic devices to a heat sink, improving thermal efficiency and reducing equipment size by leveraging phase-change properties and surface patterning to enhance heat dissipation.
Implementation Method 1
a phase-change medium capable of transitioning between a plurality of phases
Implementation Method 2
facilitating evaporation and condensation within the chamber
Implementation Method 3
facilitating evaporation and condensation within the chamber
Implementation Method 4
The condensate then returns to the evaporator via capillary forces developed in the wick
Implementation Method 5
The first surface is patterned on a first plate and includes regions having high and low affinity to the phase-change medium
Data Source
AI summary
A phase-change chamber, a method for fabricating a phase-change chamber and a heat dissipation apparatus for electronic device cooling are disclosed. The phase-change chamber includes: a phase-change medium capable of transitioning between a plurality of phases; a first surface for transitioning a portion of the phase-change medium from a first phase into a second phase; a second surface for transitioning a portion of the phase-change medium from the second phase into the first phase; and at least one supporting member along the circumference of the first surface and the second surface for separating and enclosing the first surface and the second surface. The first surface is patterned on a first plate and includes regions of high and low affinity to the phase-change medium. The second surface is received on a second plate and comprises low affinity to the phase-change medium.