Thermally Conductive Phase-Change Composition for Reworkable Thermal Management
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Solution Overview
Problem
Existing thermal management solutions struggle to effectively dissipate heat in electronic devices, particularly in small or irregularly shaped devices, where traditional methods fail to provide adequate thermal conductivity and are non-reworkable, posing risks to device performance and user safety.
Innovation Solution
A thermally conductive phase-change composition comprising 5-25% thermoplastic polymer, 20-45% phase-change material, and 30-65% thermally conductive particles, which offers reversible and tunable thermal conductivity, allowing for efficient heat dissipation through both conductive particles and phase-change material, especially in irregularly shaped cavities, and can be easily reintroduced or removed for maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal management methods are used, then device structure is simple, but thermal conductivity is insufficient and cannot effectively dissipate heat in small or irregularly shaped devices
Solution Approach 1:
The patent employs a composite material system consisting of thermoplastic polymer, phase-change material, and thermally conductive particles. This composite approach enables the material to simultaneously provide structural integrity, phase-change thermal regulation, and enhanced thermal conductivity, resolving the contradiction between improving thermal management performance and maintaining compositional simplicity.
Solution Approach 2:
The patent utilizes phase-change material that undergoes parameter changes (phase transition) at specific temperatures to dynamically regulate thermal conductivity. This allows the material to adapt its thermal properties based on operating conditions, effectively dissipating heat in small or irregularly shaped devices without requiring complex structural modifications.
2Ease of repair
If non-reworkable thermal management materials are used, then manufacturing process is simple, but ease of repair and reworkability is poor
Solution Approach 1:
The thermoplastic polymer matrix undergoes parameter changes (melting and solidification) with temperature, enabling the composite material to transition between rigid and moldable states. This allows the material to be easily removed and reapplied during repair processes while maintaining simple manufacturing through conventional molding techniques.
3Adaptability or versatility
If fixed thermal conductivity materials are used, then material composition is simple, but adaptability to different operating temperatures and device geometries is limited
Solution Approach 1:
The phase-change material provides reversible thermal conductivity changes through phase transitions, enabling the composition to adapt to different operating temperatures. The material can absorb excess heat during phase change and release it when cooling, providing dynamic thermal regulation without requiring complex multi-component systems.
Solution Approach 2:
The composite composition performs multiple functions simultaneously: structural support from thermoplastic polymer, thermal conductivity enhancement from conductive particles, and dynamic thermal regulation from phase-change material. This multi-functionality enables broad adaptability across different device types and operating conditions without proportionally increasing complexity.
4Temperature
If high thermal conductivity particles are used, then thermal management performance is improved, but manufacturing precision and filling of irregular cavities is difficult
Solution Approach 1:
The thermoplastic polymer matrix provides a flexible, moldable medium that can conform to irregular device cavities and irregularly shaped heat-generating components. This flexibility enables complete filling of complex geometries while maintaining high thermal conductivity through the embedded conductive particles, resolving the contradiction between thermal performance and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides enhanced thermal management by maintaining thermal conductivity above and below the phase-change temperature, reducing the risk of overheating and user injury, while being reworkable and adaptable to complex device geometries, thus improving device performance and safety.
Implementation Method 1
thermally conductive particles, wherein thermal conductivity of the composition is at least 3.0 W/m-K at a temperature below a transition temperature of the phase-change material
Implementation Method 2
phase-change material; thermal conductivity of the composition is at least 3.0 W/m-K at a temperature below a transition temperature of the phase-change material and thermal conductivity of the composition is at least 2.0 W/m-K at a temperature above the transition temperature of the phase-change material
Data Source
AI summary
A thermally conductive phase-change composition includes a mixture of 5 to 25 weight percent thermoplastic polymer; 20 to 45 weight percent phase-change material; and 30 to 65 weight percent thermally conductive particles, wherein weight percent is based on the total weight of the composition and totals 100 weight percent, and wherein thermal conductivity of the composition is at least 3.0 W/m-K at a temperature below the transition temperature of the phase change material and thermal conductivity of the composition is at least 2.0 W/m-K at a temperature above the transition temperature of the phase change material, wherein thermal conductivity is determined in accordance with ASTM E1530. The phase-change compositions are reworkable and can be easily and cleanly removed from a device for maintenance and repair and repositioned without causing damage to the device.