Phase-Change Cooling for High-Power Electronic Components
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Solution Overview
Problem
Conventional temperature regulating systems for electronic components, especially high-power components, are inadequate due to inefficient heat dissipation, particularly with the increasing power consumption and uneven surface heights of semiconductor packages.
Innovation Solution
A phase-change temperature regulating system that uses a fluid to directly contact the electronic component, controlling temperature through a circulation process of two phase changes of the fluid, thereby enhancing heat transfer efficiency and adapting to uneven surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat conduction cooling through pressing mechanism is used, then the structure is simple, but the temperature regulating efficiency is insufficient for high-power electronic components
Solution Approach 1:
The patent employs phase change material (PCM) that transitions between solid and liquid states to absorb and release heat. When the electronic component generates excessive heat, the PCM melts absorbing latent heat; when heat generation decreases, the PCM solidifies releasing stored heat. This phase transition mechanism enables highly efficient temperature regulation that overcomes the limitations of conventional heat conduction cooling for high-power components.
Solution Approach 2:
The pressing mechanism serves as an intermediary structure that simultaneously provides mechanical pressing force and houses the phase change material for thermal regulation. This dual-function design allows the system to achieve efficient heat dissipation without requiring separate complex cooling systems, thereby improving temperature regulating efficiency while controlling system complexity.
2Use of energy by stationary object
If pressing mechanism with heat conduction cooling is used, then the structure is simple, but energy consumption is high
Solution Approach 1:
The phase change material operates autonomously without requiring external power input. It automatically absorbs heat when the electronic component temperature rises above the PCM's melting point and releases heat when temperature drops below the melting point. This self-regulating mechanism eliminates the need for energy-consuming active cooling systems while maintaining effective temperature control.
3Adaptability or versatility
If conventional pressing mechanism is used, then the structure is simple, but it cannot adapt to uneven surface heights of semiconductor packages
Solution Approach 1:
The pressing mechanism incorporates a flexible or adjustable pressing head that can dynamically adapt to uneven surfaces. The pressing force is distributed through a compliant structure that deforms to match the surface topology of the semiconductor package, ensuring uniform contact and effective heat transfer across the entire interface despite surface height variations.
4Loss of energy
If heat conduction cooling is used, then the system is simple, but heat dissipation efficiency is insufficient for high-power components
Solution Approach 1:
The system utilizes phase change material that transitions between solid and liquid states to achieve high-efficiency heat dissipation. During phase transition, the PCM absorbs large amounts of latent heat without significant temperature increase, enabling it to handle the high heat loads from high-power electronic components far more effectively than conventional heat conduction methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves significant improvements in temperature regulating efficiency and reduces energy consumption by utilizing the fluid's phase changes to effectively transfer heat from the electronic component, even on uneven surfaces.
Implementation Method 1
the temperature regulating fluid evaporates in the temperature regulating fluid chamber and condenses on an inner surface of the temperature regulating fluid chamber
Implementation Method 2
the temperature regulating fluid evaporates in the temperature regulating fluid chamber and condenses on an inner surface of the temperature regulating fluid chamber
Implementation Method 3
controlling a temperature of the electronic component through a circulation process of two phase changes of the fluid
Implementation Method 4
use the fluid to directly contact an electronic component, and control a temperature of the electronic component through a circulation process of two phase changes of the fluid
Data Source
AI summary
A phase-change temperature regulating system and an electronic device testing apparatus and method are described. In an embodiment, the system uses a temperature regulating fluid chamber containing a temperature regulating fluid to allow the temperature regulating fluid to cover at least a part of at least one surface of an electronic component. When a temperature of the electronic component reaches a boiling point of the temperature regulating fluid, the temperature regulating fluid becomes steam through a phase change to transfer heat energy outward from the electronic component, and condenses on an inner surface of the fluid chamber to further transfer heat energy of the steam to a temperature-regulating apparatus. The condensed temperature regulating fluid flows back to the temperature regulating fluid, thereby continuously circulating.