Cooling system with intermediate chamber

Solution Overview

Problem

Conventional cooling systems for electronic components in HVAC&R systems face limitations in size, cooling capacity, and cost, particularly due to insufficient thermal conductivity and frictional forces affecting heat removal efficiency.

Innovation Solution

A cooling system with a fluid chamber and heat rejection system, utilizing an evaporating surface to vaporize fluid for heat transfer and a condensing surface to condense vapor back into liquid, combined with fins for convection cooling, enhances heat dissipation through both conduction and convection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If metallic materials are used to form heat sinks, then the heat sink structure is compact and low cost, but the thermal conductivity is insufficient to enable effective heat diffusion

Engineering Contradiction:
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent employs a composite material structure combining metal (for structural integrity and cost-effectiveness) and ceramic materials (for superior thermal conductivity). The ceramic layer is applied over the metal heat sink base, creating a composite structure that leverages the advantages of both materials: the metal provides mechanical strength and manufacturability, while the ceramic layer enhances heat diffusion efficiency across the heat sink surface.

Inventive Principle:
Principle #40Composite materials

2Temperature

If heat pipes with wick structures are used, then heat diffusion via conduction is enabled, but friction and shear forces reduce the amount of heat removed

Engineering Contradiction:
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent removes the wick structure from the heat pipe design, replacing it with a smooth-bore tube. This extraction of the problematic wick element eliminates the friction and shear forces that impede fluid flow, allowing the cooling fluid to circulate more freely through the heat pipe while maintaining effective heat transfer through conduction and convection mechanisms.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the capillary-driven mechanical wick structure with a gravity-assisted or pressure-driven fluid circulation system. By eliminating the wick's capillary action mechanism, the design substitutes a simpler fluid dynamics approach that reduces frictional losses while achieving the same heat transport function through optimized fluid flow patterns in the smooth tube.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If conventional heat sinks with fins are used, then the design is simple, but the cooling capacity is insufficient for high-heat electronic components

Engineering Contradiction:
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent incorporates phase change mechanisms by utilizing regions where the cooling fluid transitions between liquid and vapor phases within the heat exchanger structure. This phase transition approach enables significantly higher heat absorption capacity compared to conventional single-phase cooling, as the latent heat of vaporization provides an additional heat transfer mechanism that dramatically increases cooling capacity without proportionally increasing structural complexity.

Inventive Principle:
Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system improves cooling efficiency by allowing fluid to circulate without friction, leveraging both conduction and convection, thereby effectively managing heat generated by electronic components.

Implementation Method 1

the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid, such that the liquid fluid transitions to a vapor fluid within the fluid chamber

Methodology Applied
Scientific EffectVaporization: Evaporation

Implementation Method 2

the condensing surface is configured to absorb thermal energy from the vapor fluid, such that the vapor fluid condenses into the liquid fluid within the fluid chamber

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 3

the heat rejection system is coupled to an exterior surface of the enclosure, where the heat rejection system is configured to absorb thermal energy from the condensing surface

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS12590716B2Cooling system with intermediate chamber
Publication Date: 2026.03.31
  • US12590716B2 patent drawing
  • US12590716B2 patent drawing
  • US12590716B2 patent drawing

AI summary

The present disclosure relates to a cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system. The cooling system includes an enclosure defining a fluid chamber, and the enclosure includes an evaporating surface configured to be in thermal communication with a liquid fluid in the fluid chamber and with an electronic component coupled to the enclosure, where the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid, such that the liquid fluid transitions to a vapor fluid within the fluid chamber, and includes a condensing surface configured to absorb thermal energy from the vapor fluid, such that the vapor fluid condenses into the liquid fluid within the fluid chamber. The cooling system also includes a heat rejection system coupled to an exterior surface of the enclosure, where the heat rejection system is configured to absorb thermal energy from the condensing surface.