Phase-Change Cooling Panel for Multi-Source Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation technologies face limitations in effectively dissipating heat generated by multiple heat-generating elements in electronic devices, particularly in MIMO systems, due to the thermal conductivity constraints of cooling media, which can lead to performance degradation and potential overheating issues.
Innovation Solution
An active heat dissipation apparatus utilizing a thermal conduction panel body with a refrigerant flow space, joint portions, absorbers, and absorber retaining portions to facilitate active heat transfer through phase change of refrigerant, enhancing manufacturability and heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is achieved through thermal conductivity of cooling medium, then heat transfer occurs through material conduction, but heat dissipation performance is limited by the thermal conductivity constraint of the cooling medium
Solution Approach 1:
The patent employs phase change of refrigerant (liquid-gas transition) as the core heat transfer mechanism. The refrigerant absorbs heat from heat-generating elements through evaporation and releases heat through condensation, achieving superior heat dissipation performance that overcomes the thermal conductivity limitations of conventional solid cooling media. This is explicitly stated in the technical problem section and demonstrated in the embodiment where refrigerant 117 is used for phase change heat transfer.
Solution Approach 2:
The patent utilizes a refrigerant circulation system with liquid and vapor phases to achieve active heat transfer. The refrigerant flows through the cooling apparatus in different phases, enabling heat absorption and release cycles that provide enhanced heat dissipation compared to passive thermal conduction through solid materials.
2Productivity
If multiple heat-generating elements are used in MIMO systems, then data transmission capacity increases, but heat dissipation becomes more difficult due to increased number of heat sources
Solution Approach 1:
The cooling apparatus is divided into multiple independent cooling chambers (first cooling chamber, second cooling chamber, etc.), each capable of cooling individual heat-generating elements. This segmented structure allows simultaneous cooling of multiple heat sources, matching the multi-element configuration of MIMO systems while maintaining effective heat dissipation for each element.
Solution Approach 2:
The refrigerant-based cooling system provides a universal cooling mechanism that can handle multiple heat-generating elements simultaneously. Each cooling chamber uses the same phase-change principle, allowing the system to scale with the number of antennas and heat-generating elements in MIMO configurations.
3Loss of energy
If conventional thermal conduction method is used, then heat transfer occurs through material contact, but heat dissipation efficiency is insufficient for high-power electronic devices
Solution Approach 1:
The patent utilizes phase change of refrigerant (liquid-gas transition) as the core heat transfer mechanism. The refrigerant absorbs heat from heat-generating elements through evaporation and releases heat through condensation, achieving superior heat dissipation performance that overcomes the thermal conductivity limitations of conventional solid cooling media.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus significantly improves heat dissipation by actively transferring heat through refrigerant phase change, overcoming thermal conductivity limitations and ensuring efficient heat management in electronic devices.
Implementation Method 1
capable of improving heat dissipation performance by actively transferring heat generated from a heat-generating device (e.g., an electronic device) through a phase change of a refrigerant
Implementation Method 2
an absorber disposed in the refrigerant flow space and configured to absorb a liquid-phase portion of the refrigerant
Data Source
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AI summary
The present invention relates to an active heat dissipation apparatus comprising: a heat conduction panel body, which is made of a thermally conductive material and comprises a heat conduction panel on one side and a heat conduction panel on the other side that respectively constitute one side and the other side of a thickness portion, forming a refrigerant flow space of a predetermined thickness in which a refrigerant is filled and flows; a plurality of joints arranged on each of the heat conduction panel on one side and the heat conduction panel on the other side to join the heat conduction panels in the refrigerant flow space; and an absorber disposed in the refrigerant flow space to absorb a liquid refrigerant among the refrigerant, wherein the plurality of joints are interconnected by penetrating the absorber in a thickness direction, thereby providing the advantage of significantly improving heat dissipation performance.