Phase-Change Cooling Panel Layout for Slim Electronic Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material restrictions, and increased product size, and are challenged by the need for more effective refrigerants that comply with environmental regulations.
Innovation Solution
The active heat dissipation apparatus employs a thermal conduction panel body with a refrigerant flow space, utilizing stainless steel (SUS) for improved manufacturability and thermal conductivity, and incorporates a refrigerant flow path design that minimizes spacing from heat sources, allowing phase change refrigerants like water to enhance heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy is used for heat dissipation fins, then thermal conductivity is improved, but material restrictions and manufacturing costs increase
Solution Approach 1:
The patent changes the material parameter from aluminum alloy to stainless steel, and changes the heat dissipation mechanism parameter from pure thermal conduction to phase change refrigerant system. This resolves the contradiction by achieving effective heat dissipation through a different physical mechanism that doesn't require restricted materials.
Solution Approach 2:
The patent introduces phase change refrigerant (water) that transitions between liquid and vapor phases to transfer heat. The refrigerant absorbs heat from the heat generation device through evaporation and releases it through condensation, achieving superior heat dissipation without relying on high-conductivity materials like aluminum alloy.
2Temperature
If thermal conduction material is used, then heat transfer is improved, but product size increases
Solution Approach 1:
The patent uses a refrigerant fluid (water) in a closed circulation system to transfer heat. The fluid absorbs heat through evaporation and releases it through condensation, enabling efficient heat transfer in a compact volume without requiring large thermal conduction materials.
Solution Approach 2:
The phase change process of the refrigerant allows for high heat transfer efficiency in a compact space. The latent heat absorption during evaporation and release during condensation enables effective heat dissipation without increasing product size, unlike traditional thermal conduction materials that require substantial volume.
3Temperature
If conventional refrigerants are used, then heat dissipation performance is improved, but environmental compliance deteriorates
Solution Approach 1:
The patent uses water as a refrigerant, which is abundant, inexpensive, and environmentally benign. Water can be continuously circulated and phase-changed without depleting resources or harming the environment, replacing conventional refrigerants that have environmental restrictions.
Solution Approach 2:
Water as a refrigerant creates an environmentally safe system. It is non-toxic, non-flammable, and does not deplete the ozone layer, providing an inert environment from an ecological perspective that complies with all environmental regulations while maintaining effective heat dissipation performance.
4Device complexity
If heat dissipation fins are integrated with housing, then structure is simplified, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a refrigerant as an intermediary substance between the heat generation device and the external environment. The refrigerant absorbs heat directly from the heat generation device through phase change, serving as an efficient heat transfer medium that doesn't require integrated heat dissipation fins.
Solution Approach 2:
The phase change mechanism of the refrigerant provides superior heat transfer efficiency compared to thermal conduction through integrated fins. The latent heat absorption and release during phase transitions enables effective heat dissipation without requiring complex integrated fin structures, thus maintaining simple device architecture while achieving excellent heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves superior heat dissipation performance, reduces manufacturing costs, and complies with environmental regulations by using water as a refrigerant, while maintaining product slimness and efficiency.
Implementation Method 1
capable of improving heat dissipation performance by actively transferring heat, which is generated from a heat generation device (e.g., an electronic device), by means of a phase change of a refrigerant
Implementation Method 2
by means of a phase change of a refrigerant more effective than characteristics of a thermal conduction material
Data Source
AI summary
The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, the active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space with which a refrigerant is filled, in which the refrigerant flow space includes a first refrigerant flow path in which the thermal conduction panel body is supplied with heat from a heat generation element that is a heat dissipation target, and a plurality of second refrigerant flow paths connected to the first refrigerant flow path and configured such that a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, is uniformly supplied to the first refrigerant flow path, thereby significantly improving heat dissipation performance.