Phase-Change Cooling Plate for Faster Lateral Heat Conduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid-cooling heat dissipation systems face inefficiencies in heat conduction and dissipation due to limited lateral heat conduction speed and area, especially with high-density heat sources in high-end AI servers, leading to insufficient heat dissipation capabilities.
Innovation Solution
A liquid-cooling heat dissipation system utilizing a vapor chamber with a high thermal conductivity and rapid phase transformation of working fluid for enhanced heat dissipation, combined with a liquid-cooling heat dissipation plate and fan-assisted air cooling to improve heat exchange efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional liquid-cooling plates are used, then the system structure is simple, but the lateral heat conduction speed is limited and heat dissipation efficiency is insufficient
Solution Approach 1:
The patent employs phase change material (paraffin) enclosed in aluminum foil packets within the heat dissipation plate. When heat is applied, the paraffin undergoes phase transition from solid to liquid, absorbing large amounts of latent heat and rapidly conducting heat laterally across the plate structure, thereby resolving the contradiction between structural simplicity and heat dissipation efficiency
Solution Approach 2:
The heat dissipation plate combines multiple materials: aluminum alloy base structure for structural integrity, paraffin phase change material for heat absorption and lateral conduction, and aluminum foil for encapsulation. This composite structure achieves both manufacturing feasibility and superior heat dissipation performance
2Power
If high-density heat sources are used in AI servers, then computing power increases, but heat dissipation capability becomes insufficient
Solution Approach 1:
The phase change material acts as an intermediary between the high-density heat sources (GPUs/CPUs) and the cooling system. It absorbs and redistributes heat laterally through phase transition, preventing localized overheating and enabling the system to handle higher computing power densities
Solution Approach 2:
The patent changes the thermal parameters of the heat dissipation plate by incorporating phase change material, which dramatically increases the effective heat capacity and thermal conductivity during phase transition, enabling dissipation of over 700W heat density required for high-end AI servers
3Productivity
If immersion cooling is used, then heat dissipation efficiency reaches above 1500W, but infrastructure redesign is required and coolant cost is extremely high
Solution Approach 1:
The patent extracts the phase change mechanism from the context of full immersion cooling and applies it to a conventional liquid cooling plate structure. This maintains the heat dissipation efficiency benefits while eliminating the need for infrastructure redesign and expensive specialized coolants
Solution Approach 2:
The patent uses readily available, inexpensive materials (paraffin, aluminum foil, aluminum alloy) instead of expensive immersion coolants, achieving cost-effective heat dissipation without requiring specialized infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves rapid and effective heat dissipation with thermal conductivity up to 10,000 W/(m²·°C), significantly improving heat dissipation efficiency and reducing energy consumption by minimizing the need for external cooling systems.
Implementation Method 1
utilizing a vapor chamber with a high thermal conductivity and rapid phase transformation of working fluid for enhanced heat dissipation
Implementation Method 2
The system achieves rapid and effective heat dissipation with thermal conductivity up to 10,000 W/(m²·°C)
Implementation Method 3
fan-assisted air cooling to improve heat exchange efficiency
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A liquid-cooling heat dissipation system (10, 20) includes: a liquid-cooling vapor chamber (100), a liquid-cooling heat dissipation plate (200), a first and a second coolant pipelines (300, 400) connecting the two, a coolant circulation machine (500), a fan (600), and a cooling liquid (700). The liquid-cooling vapor chamber (100) includes a liquid-cooling cover (110), a metallic top cover (120), and a metallic bottom cover (130-134). The liquid-cooling heat dissipation plate (200, 201) includes a heat dissipation bottom plate (210) and a heat dissipation outer cover (220, 221). The coolant circulation machine (500) pumps the cooling liquid (700) from the first coolant pipeline (300, 301) into the liquid cooling cover (110), and then flows into the liquid-cooling heat dissipation plate (200, 201). The fan (600) locked on the bottom plate outer surface (2102) blows air to the liquid-cooling heat dissipation plate (200, 201), so that the cooling liquid (700) is cooled when flowing through the second accommodation space (2203) in the liquid cooling heat dissipation plate (200, 201), and then flows back to the coolant circulations machine (500) for recirculation.