Phase-Change Heat Dissipation Structure for Memory and CPU Cooling
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Solution Overview
Problem
Existing air cooling methods for heat dissipation in computer devices, such as memory modules and CPUs, are inefficient, leading to suboptimal heat management.
Innovation Solution
A heat dissipation device with expandable heat exchange units that utilize a phase change medium to adjust their size and enhance contact with heat sources, coupled with a medium transmission member to efficiently transfer heat away.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling is used to dissipate heat from memory modules, then the cooling method is simple to implement, but heat dissipation efficiency is low
Solution Approach 1:
The patent utilizes the phase transition properties of phase change media (solid-liquid-gas transitions) within the heat exchange units to enable dynamic volume expansion and contraction. This allows the heat dissipation device to adapt its contact area with heat sources, significantly improving heat dissipation efficiency compared to conventional air cooling methods while maintaining relatively simple implementation through the use of encapsulated phase change materials.
Solution Approach 2:
The heat exchange units are designed to dynamically change their volume and shape in response to temperature changes of the phase change media. This dynamic adaptation allows the cooling device to automatically adjust its contact area with heat-generating components, optimizing heat dissipation performance under varying thermal conditions without complex control systems.
2Productivity
If heat exchange units are expanded to increase contact area with heat sources, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The phase change media automatically respond to temperature changes by undergoing phase transitions, which in turn cause the heat exchange units to expand or contract. This self-regulating mechanism eliminates the need for external control systems, actuators, or complex mechanical structures to achieve volume adjustment, thereby improving heat dissipation efficiency while keeping the device structure relatively simple.
Solution Approach 2:
The patent changes the physical state parameters (temperature, phase) of the phase change media to control the volume of the heat exchange units. By utilizing the inherent thermal response of phase change materials, the system achieves dynamic adaptation of contact area without requiring complex control mechanisms or additional components.
3Ease of manufacture
If rigid heat exchange structures are used, then manufacturing is simple, but contact area with irregular heat sources is insufficient
Solution Approach 1:
The heat exchange units are designed with flexible, deformable structures that can change their shape and volume. This flexibility allows the units to conform to irregular surfaces of heat-generating components, maximizing contact area while maintaining manufacturing simplicity through the use of elastomeric materials and encapsulated phase change media.
Solution Approach 2:
The heat exchange units transition from rigid to dynamic structures that can adapt their shape in response to thermal conditions. The deformable design enables the units to automatically adjust their configuration to match the geometry of heat sources, ensuring optimal contact area without requiring complex manufacturing processes for custom-fitted rigid components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency by increasing contact area and reducing leakage risks, thereby enhancing the overall cooling performance of electronic equipment.
Implementation Method 1
a phase change medium disposed in the heat exchange unit, the phase change medium used for changing a volume of the heat exchange unit
Implementation Method 2
Each of the plurality of heat exchange members 30 is arranged in a corresponding each of the plurality of heat exchange cavities Q1. The heat exchange member 30 is configured to absorb heat generated from the heat source member 201, and transfer the heat to the medium transmission member 10
Data Source
AI summary
A heating dissipation device, comprising a medium transmission member, a plurality of heat exchange units and a plurality of heat exchange members. The medium transmission member comprising a transmission cavity for conveying a heat exchange medium. The plurality of heat exchange units are spaced apart from each other and connected to the medium transmission member, two adjacent heat exchange units are defined a receiving space therebetween, the receiving space receives a corresponding heat source member therein, the heat exchange units has a heat exchange cavity. Each of the plurality of heat exchange members is respectively arranged in a corresponding each of the plurality of heat exchange cavities, the heat exchange unit absorbs heat generated from the heat source member, then the heat is transferred to the transmission member via the heat exchange member. Each of the plurality of heat exchange units has a first state and a second state.