Phase Change Heat Dissipating Pad for Thermal Management
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Solution Overview
Problem
Portable electronic devices such as SSDs and laptops face thermal stability issues due to heat dissipation challenges, leading to discomfort for users as the device surface temperature increases.
Innovation Solution
Incorporating a heat dissipating pad with a thermal conductive material layer and phase change particles encapsulated in capsules, which absorb and release heat efficiently, and a bracket with encapsulated phase change material to manage heat capacity and delay thermal throttling, thereby controlling surface temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is dissipated through a heat sink or thermal interface material, then thermal stability of internal electronic components is improved, but the surface temperature of the device increases causing user discomfort
Solution Approach 1:
The device is divided into separate thermal management zones: an internal heat sink for component cooling and an outer casing with phase change material for surface temperature control. This segmentation allows independent optimization of internal heat dissipation and external surface temperature without compromising either function.
Solution Approach 2:
A phase change material is introduced as an intermediary between the internal heat-generating components and the external surface. This material absorbs excess heat through phase transition, acting as a thermal buffer that prevents heat from reaching the user-contact surface while maintaining internal component cooling.
2Duration of action of stationary object
If phase change material is used to increase heat capacity, then thermal throttling time is delayed, but device complexity increases
Solution Approach 1:
The patent utilizes phase transition of material (solid-liquid transition) to create a passive thermal management system. The phase change material automatically absorbs heat during phase transition, extending the operational duration before thermal throttling occurs without requiring active control mechanisms.
Solution Approach 2:
The phase change material provides self-regulating thermal management without external control. When temperature rises, the material automatically undergoes phase change to absorb heat, and when temperature drops, it solidifies and releases heat, creating a self-balancing thermal system that reduces the need for complex active cooling controls.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces user discomfort by maintaining lower surface temperatures even during high operating temperatures, by increasing heat capacity and delaying thermal throttling through the phase change material's heat absorption and release mechanisms.
Implementation Method 1
The phase change material in a solid state may have a first heat capacity coefficient, and the phase change material in a liquid state may have a second heat capacity coefficient higher than the first heat capacity coefficient
Implementation Method 2
the phase change material's heat absorption and release mechanisms
Implementation Method 3
a thermal conductive material layer covering the at least one electronic element
Data Source
AI summary
An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.