Phase Change Heat Dissipation Device for Compact Electronics
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Solution Overview
Problem
Current mobile processing devices face challenges in achieving high performance while maintaining a compact design due to increased heat dissipation requirements, as larger heat dissipation fins and higher-power fans occupy more internal volume.
Innovation Solution
A heat dissipation device with a casing containing 15-30% copper materials, 50-85% phase change material, and 15-20% air, which absorbs heat through thermal radiation and distributes it using copper tubes or plates, allowing for efficient heat transfer without the need for a large fan, thus maintaining a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fan power and heat dissipation area are increased to improve heat removal rate, then heat dissipation performance is improved, but internal volume of the device increases
Solution Approach 1:
The patent utilizes phase change material (paraffin) that transitions from solid to liquid state to absorb heat from the heat source. This phase transition mechanism enables efficient heat absorption without requiring large heat dissipation fins or high-power fans, thereby maintaining a compact device volume while improving heat removal rate.
Solution Approach 2:
The patent employs a composite heat dissipation structure combining copper materials (for thermal conduction), phase change material (for heat absorption), and air (for insulation and volume expansion during phase change). This composite approach optimizes heat dissipation performance while minimizing the required internal volume.
2Area of stationary object
If heat dissipation fins are enlarged to increase heat dissipation area, then heat dissipation performance is improved, but device compactness deteriorates
Solution Approach 1:
The phase change material absorbs heat through solid-liquid transition, eliminating the need for large heat dissipation fins. The heat is absorbed within the compact casing volume, maintaining device compactness while achieving effective heat dissipation.
Solution Approach 2:
The patent replaces the mechanical convection-based heat dissipation system (fans and large fins) with a thermal radiation and phase change-based system. The heat dissipation device absorbs heat primarily through thermal radiation from the heat source, substituting mechanical airflow with thermal field-based heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively absorbs and disperses heat evenly, maintaining a comfortable temperature and reducing noise, making it suitable for thin electronic devices without the need for an exhaust fan.
Implementation Method 1
The phase change material absorbs heat to change phase
Implementation Method 2
The heat dissipation device absorbs heat of the heat source through thermal radiation
Implementation Method 3
Copper tubes or plates are disposed within the casing to distribute heat through the casing
Implementation Method 4
The air is more compressible than the phase change material so that the air gives up volume to the phase change material as the phase change material changes phase to absorb heat
Data Source
AI summary
An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The heat dissipation device has a surface facing the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. An orthographic projection region on the surface is in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal radiation.