Phase-Change Heat Dissipation Device for Electronic Surface Temperature Control
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Solution Overview
Problem
Electronic devices generate excessive heat during high-power operation, leading to elevated surface temperatures that discomfort users, especially when worn, as existing heat dissipation methods fail to effectively control surface temperatures.
Innovation Solution
A heat dissipation device comprising a heat conducting cover with a closed cavity and phase-change-energy-storage material fillers that deform to absorb heat, changing shape to enhance heat absorption efficiency and reduce surface temperature by storing heat away from the device housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods are used, then heat can be dissipated from the electronic device, but the surface temperature remains high causing user discomfort
Solution Approach 1:
The patent utilizes phase-change materials (PCM) that undergo phase transition from solid to liquid at specific temperatures, absorbing large amounts of latent heat in the process. This phase transition mechanism enables the heat dissipation device to effectively absorb and store heat generated by electronic components, significantly reducing surface temperature and eliminating user discomfort during high-power operation.
Solution Approach 2:
The patent employs shape-memory materials that change their physical properties (shape, stiffness) in response to temperature changes. These materials undergo parameter changes at specific temperature thresholds, allowing the device to adaptively adjust its heat dissipation characteristics based on real-time temperature conditions, thereby optimizing thermal management and maintaining comfortable surface temperatures.
2Adaptability or versatility
If more electronic components are integrated to increase device functionality, then device capabilities improve, but heat generation increases leading to higher surface temperatures
Solution Approach 1:
The patent introduces phase-change materials and shape-memory materials as intermediary substances between heat-generating electronic components and the device housing. These intermediary materials act as thermal buffers, absorbing excess heat through phase transitions and adaptive structural changes, thereby decoupling the relationship between component integration density and surface temperature, and enabling high functionality without compromising thermal comfort.
3Loss of energy
If traditional heat dissipation structures are used, then heat can be transferred away from components, but surface temperature control is insufficient during high-power operation
Solution Approach 1:
The patent transforms static heat dissipation structures into dynamic adaptive systems using shape-memory materials. These materials dynamically adjust their physical state and thermal conductivity in response to temperature changes, enabling real-time optimization of heat transfer pathways. During high-power operation, the dynamic response of shape-memory materials allows the device to actively modulate heat dissipation efficiency, achieving superior surface temperature control compared to traditional static structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively delays temperature increase on the electronic device's surface, maintaining user comfort by reducing thermal resistance and preventing excessive surface temperatures during high-power operation, while allowing efficient heat dissipation through shape-memory materials and phase-change materials.
Implementation Method 1
a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. In response to a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device
Implementation Method 2
a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity
Data Source
AI summary
A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device.