Phase Change Heat Dissipation Device for Compact Electronics
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Solution Overview
Problem
Existing mobile processing devices face challenges in achieving compact designs while maintaining high performance due to increased heat dissipation area and fan power requirements, which hinder efficient heat removal without increasing internal volume.
Innovation Solution
A heat dissipation device comprising a casing with a heat dissipation material mix of 15-30% copper, 50-85% phase change material, and 15-20% air, where copper tubes or plates distribute heat and the phase change material absorbs heat without temperature rise, allowing for efficient thermal conduction and dispersion without the need for an exhaust fan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the heat dissipation area of heat dissipation fins and fan power are increased to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but the internal volume of the mobile processing device increases
Solution Approach 1:
The patent employs phase change material that transitions from solid to liquid when absorbing heat, enabling efficient heat dissipation without increasing volume. The phase change material absorbs latent heat during the phase transition process, providing high heat dissipation efficiency in a compact form factor.
Solution Approach 2:
The patent uses a composite heat dissipation material consisting of phase change material combined with copper particles and binder. This composite structure leverages the high heat capacity of phase change material and the thermal conductivity of copper particles to achieve efficient heat dissipation in a compact volume.
2Productivity
If fan power and heat dissipation area are increased to remove additional heat, then heat removal capability is improved, but device complexity and size increase
Solution Approach 1:
The patent replaces the mechanical fan-based cooling system with a passive phase change material-based heat dissipation system. This substitution eliminates the need for moving parts, control mechanisms, and power consumption associated with fans, thereby reducing device complexity while maintaining heat removal capability.
Solution Approach 2:
The phase change material automatically absorbs and dissipates heat through its inherent phase transition properties without requiring external control systems, power sources, or mechanical components. The system self-regulates heat dissipation based on temperature conditions, eliminating the need for complex control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat absorption and dispersion in a compact form factor, maintaining a comfortable temperature and reducing noise, suitable for thin electronic devices without the need for additional cooling mechanisms.
Implementation Method 1
50 to 85 percent volume of a phase change material... The phase change material absorbs heat without temperature rise
Implementation Method 2
15 to 30 percent volume of multiple copper materials... The heat dissipation device absorbs heat from the heat source through thermal conduction
Implementation Method 3
The air is more compressible than the phase change material so that the air gives up volume to the phase change material as the phase change material changes phase
Data Source
AI summary
An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material and 15 to 20 percent volume of air. The heat dissipation device has a surface thermally contacting the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. The heat source is located in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal conduction.