Phase-Change Heat Spreader for Multi-Die Package Temperature Control
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Solution Overview
Problem
Conventional heat spreaders for IC packages face challenges with temperature control due to differences in heat transfer rates among IC dies, leading to uneven operation and increased stress on the chip package.
Innovation Solution
A heat spreader with a metal body and a sealed internal cavity filled with a thermally conductive material that has interstitial spaces for fluid flow, along with one or more phase change materials to enhance heat transfer and reduce deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid adhesive connection is used between the lid and IC dies, then the lid is securely attached, but temperature control deteriorates and thermal stress increases
Solution Approach 1:
The patent replaces rigid adhesive connections with a flexible membrane that selectively contacts different IC dies. This membrane provides mechanical attachment while allowing thermal expansion and contraction, preventing the rigid stress transfer that causes poor temperature control and thermal stress in conventional designs.
Solution Approach 2:
The flexible membrane acts as an intermediary between the lid and IC dies, providing a compliant interface that accommodates differential thermal expansion. This intermediary layer decouples the rigid connection, allowing each die to maintain its own thermal characteristics while still being mechanically supported.
2Loss of energy
If conventional heat spreaders are used with multiple IC dies, then heat dissipation is provided, but uneven heat transfer rates cause differential heating and operational differences
Solution Approach 1:
The patent employs a flexible membrane with selectively positioned contact regions that provide customized thermal coupling for each IC die. Each contact region can be optimized for the specific thermal characteristics of the underlying die, allowing differential heat transfer rates to be managed locally rather than forcing uniform heat distribution across all dies.
Solution Approach 2:
The flexible membrane provides dynamic thermal coupling that can adapt to different thermal expansion states of individual IC dies. As temperatures change, the membrane flexes to maintain optimal contact pressure and thermal coupling for each die, accommodating differential heating rates without causing mechanical stress or operational failures.
3Adaptability or versatility
If different IC dies have different heat transfer rates to the lid, then various functions are enabled, but one die operates much differently than others
Solution Approach 1:
The flexible membrane provides locally optimized thermal coupling for each IC die, allowing each die to operate at its optimal thermal condition while maintaining mechanical support. This local customization enables functional diversity across different dies while preventing the operational inconsistencies that arise from forced uniform heat distribution.
Solution Approach 2:
The dynamic flexibility of the membrane allows it to adapt to the varying thermal expansion and operational characteristics of different IC dies. This dynamic adaptation maintains reliable mechanical and thermal contact for each die regardless of its specific heat transfer rate, ensuring operational consistency across functionally diverse components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat spreader effectively manages heat transfer across IC dies, reducing the need for active cooling and minimizing thermal stress, thereby improving device performance and reliability.
Implementation Method 1
A first phase change material fills at least a portion of the interstitial space of the thermally conductive material
Implementation Method 2
A first phase change material fills at least a portion of the interstitial space of the thermally conductive material
Implementation Method 3
A thermally conductive material fills the sealed internal cavity. The thermally conductive material has an interstitial space sufficient to allow fluid to pass therethrough
Data Source
AI summary
Disclosed herein is a heat spreader for use with an IC package, the heat spreader having features for enhanced temperature control of the IC package. A heat spreader for use with an IC package is disclosed. In one example, the heat spreader includes a metal body that has a sealed internal cavity. A thermally conductive material fills the sealed internal cavity. The thermally conductive material has an interstitial space sufficient to allow fluid to pass therethrough. A first phase change material fills at least a portion of the interstitial space of the thermally conductive material.