Reusable Phase-Change Thermal Interface Using Metal Foam
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Solution Overview
Problem
Conventional thermal interface materials are not reusable, leading to cumbersome cleaning and disposal issues, and they often compromise thermal conductivity due to poor thermal conductivity compared to metals, especially when surface irregularities between heat sources and heat sinks are not minimized.
Innovation Solution
A reusable phase-change thermal interface structure utilizing a metal-based foam with a fusible metal alloy that transitions from a solid to a liquid phase, allowing it to fill surface irregularities and provide enhanced thermal conductivity between heat sources and heat sinks, while being easily decoupled and reused.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal interface materials are used to fill gaps between heat sources and heat sinks, then thermal contact resistance is reduced, but thermal conductivity is compromised due to poor thermal conductivity of these materials compared to metals
Solution Approach 1:
The patent changes the physical state parameter of the thermal interface material from solid to liquid through phase change. The material exists as a solid during assembly and handling, then transitions to a liquid phase during operation to fill surface irregularities and provide enhanced thermal conductivity, effectively resolving the contradiction between reducing thermal contact resistance and maintaining thermal conductivity
Solution Approach 2:
The patent utilizes phase transition of the thermal interface material between solid and liquid states. The material melts at operating temperature to become liquid, filling cavities and crevices for optimal thermal contact, then solidifies during cooling for easy removal and reuse, thereby achieving both low thermal contact resistance and high thermal conductivity without the limitations of conventional materials
2Ease of operation
If thermal interface materials are designed for reusability, then cleaning and disposal issues are resolved, but the materials must be easily removable from surfaces
Solution Approach 1:
The patent employs phase transition to enable easy removal and reuse of the thermal interface material. The material transitions from liquid to solid phase upon cooling, allowing it to be easily detached from surfaces without leaving residues, thus achieving reusability while maintaining ease of manufacture and assembly
Solution Approach 2:
The reusable thermal interface material can be recovered and reused multiple times, creating a sustainable cycle that eliminates the need for continuous manufacturing of new materials, thereby resolving the contradiction between reusability and ease of manufacture
3Reliability
If surface irregularities between heat sources and heat sinks are minimized to reduce thermal resistance, then thermal conduction is improved, but the complexity of manufacturing and assembly increases
Solution Approach 1:
The patent changes the physical state of the thermal interface material to liquid during operation, allowing it to flow into and fill surface irregularities automatically. This eliminates the need for complex surface preparation processes while achieving low thermal resistance, as the liquid material conforms to any surface topology
Solution Approach 2:
The liquid thermal interface material performs self-leveling and self-filling of surface irregularities through its fluid properties, eliminating the need for external intervention or complex manufacturing processes to achieve smooth surfaces, thereby reducing device complexity while maintaining low thermal resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively reduces thermal resistance, facilitates hassle-free removal and reinsertion of components, and maintains optimal thermal and mechanical properties, enhancing heat dissipation and extending the life cycle of thermal interfaces.
Implementation Method 1
the fusible metal based alloy is configured to be in the solid phase at an assembling temperature and in the liquid phase at an operating temperature
Implementation Method 2
a reusable phase-change thermal interface structure utilizing a metal-based foam with a fusible metal alloy that transitions from a solid to a liquid phase
Implementation Method 3
the thermal interface materials are positioned at the interface of the heat source and heat sink to fill gaps or voids between the two mating surfaces so that the thermal resistance is lowered, thereby allowing the heat to flow away efficiently
Data Source
AI summary
A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.