Slot-Mountable Rack Cooling Module with Phase-Change Heat Absorption
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Solution Overview
Problem
Existing electronics rack mounts rely on inefficient cooling methods like air cooling, liquid cooling, and heat pipes, which are costly, require specific designs, and are inadequate for high-power applications, necessitating a more effective and adaptable cooling solution.
Innovation Solution
A slot-mountable rack mount module containing materials that absorb heat through phase changes or endothermic reactions, allowing for scalable and efficient cooling within electronics racks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air cooling, liquid cooling, or heat pipes are used for cooling electronics rack mount, then cooling capability is provided, but the system becomes complex, costly, and requires specific design interfaces for each platform
Solution Approach 1:
The patent uses phase change materials (such as paraffin wax or salt hydrates) that absorb heat during phase transition from solid to liquid state. This provides passive cooling without requiring complex active cooling systems, pumps, or heat pipes, thereby reducing system complexity while maintaining effective cooling capability
Solution Approach 2:
The cooling modules are designed as disposable or replaceable units containing phase change materials. After the phase change material is consumed, the entire module can be replaced rather than requiring complex maintenance or refilling operations, simplifying the overall system architecture and reducing operational complexity
2Reliability
If liquid cooling with external reservoirs and pumps is used, then cooling effectiveness is improved, but the device complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the complex pump and reservoir components from the cooling system by using phase change materials that provide passive cooling. The cooling function is achieved through the inherent phase transition properties of the material rather than active fluid circulation, removing the need for mechanical pumping components
Solution Approach 2:
The phase change material automatically absorbs heat when temperature increases, requiring no external control or power input. The cooling action is self-regulating based on temperature conditions, eliminating the need for pumps, valves, and control systems required in active liquid cooling
3Reliability
If heat pipes with specific condenser location are used, then cooling is provided, but the system requires expensive custom interfaces and specific installation requirements
Solution Approach 1:
The cooling modules are designed with universal interfaces that can be mounted in standard rack positions (1U, 2U, 3U heights) and work with various platform configurations. The phase change material provides cooling through thermal conduction and phase transition, which are platform-agnostic mechanisms that do not require custom condenser locations or platform-specific interfaces
Solution Approach 2:
The cooling system is divided into discrete, modular units that can be independently installed in different rack positions. Each module is self-contained with its own phase change material reservoir, allowing flexible deployment across different platforms without requiring integrated custom interfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat absorption, extending system operational duration and simplifying mission equipment scaling, suitable for various platforms including attritable and expendable systems.
Implementation Method 1
The at least one material is configured to absorb heat from within the electronics rack mount based at least on at least one phase change of at least one of the at least one material
Implementation Method 2
The at least one material is configured to absorb heat from within the electronics rack mount based at least on at least one of (a) at least one phase change of at least one of the at least one material or (b) at least one endothermic reaction of one or more of the at least one material
Data Source
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AI summary
A system includes a slot-mountable rack mount module (104). The slot-mountable rack mount module is shaped and sized to be mountable into a given rack mount slot of an electronics rack mount (102). The electronics rack mount has multiple rack mount slots including the given rack mount slot. The slot-mountable rack mount module includes: a vessel (202) containing at least one material (204). The at least one material is configured to absorb heat from within the electronics rack mount based at least on at least one of (a) at least one phase change of at least one of the at least one material or (b) at least one endothermic reaction of one or more of the at least one material.