Phase-Change Thermal Channel for Semiconductor Heat Dissipation
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Solution Overview
Problem
Semiconductor devices in electronic assemblies, such as microprocessors and power electronic modules, face thermal constraints that limit performance, particularly in high-power applications like off-road vehicles and heavy equipment, where efficient thermal dissipation is needed to maintain compactness and performance.
Innovation Solution
An electronic assembly incorporating hermetically sealed thermal channels with phase-change materials, such as refrigerants, that evaporate and condense to absorb and dissipate thermal energy from semiconductor devices, using capillary action and wicking sections to facilitate continuous heat transfer to a heat sink, ensuring efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods are used, then thermal management is achieved, but device compactness and power density are compromised
Solution Approach 1:
The patent employs phase-change material (PCM) that transitions between solid and liquid phases to absorb and store thermal energy. The PCM undergoes phase change at a specific temperature, absorbing large amounts of latent heat during evaporation and releasing it during condensation, enabling compact thermal management with high power density
Solution Approach 2:
The patent utilizes capillary action within porous wicking material to transport the liquid phase-change material through the thermal management device. The capillary forces drive the liquid PCM through channels without requiring external pumps, enabling passive thermal transport in a compact configuration
2Power
If high power density is achieved, then performance is improved, but thermal constraints worsen
Solution Approach 1:
The patent changes the thermal parameters by using phase-change material with specific latent heat properties. The PCM absorbs thermal energy during phase transition, maintaining relatively constant temperature despite high power input, thus enabling high power density while managing thermal constraints through parameter optimization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages thermal energy by maintaining low thermal resistance and enabling compact, high-power semiconductor devices to operate efficiently, even under demanding conditions like transient loads and computationally intensive tasks.
Implementation Method 1
A phase-change material contained in the hermetically sealed thermal channel evaporates and condenses to absorb and dissipate thermal energy
Implementation Method 2
A phase-change material contained in the hermetically sealed thermal channel evaporates and condenses to absorb and dissipate thermal energy
Implementation Method 3
using capillary action and wicking sections to facilitate continuous heat transfer to a heat sink
Data Source
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AI summary
An electronic assembly with phase-change material for thermal performance comprises a substrate and a semiconductor device mounted on the substrate. A sealed first thermal channel comprises a first evaporator section, a first fluid transport section, and a first condenser section. A phase-change material is contained in the sealed first thermal channel. The first evaporator section overlies the semiconductor device. The first fluid transport section extends between the first evaporator section and the first condenser section. The first evaporator section is spaced apart from the first condenser section. The first condenser section is in thermal communication with the heat sink.