Thermal Interface Device with Phase-Change Containment
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Solution Overview
Problem
Conventional thermal interface materials face limitations in accommodating varying tolerances between electronic components and heat sinks due to their low thermal conductivity and limited compressibility, which hinders efficient heat transfer and mechanical compatibility.
Innovation Solution
A thermal interface device with a deformable containment structure and shape-changing components that can reversibly transform to provide a compliant and flexible interface, allowing for enhanced thermal conductivity and mechanical accommodation of different components' expansions and contractions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermally conductive pads are used to improve thermal conductivity, then thermal conductivity increases, but compressibility is limited to 10-20%
Solution Approach 1:
The patent employs a composite structure combining a foam core with a thermally conductive skin layer. The foam core (polymer or elastomer) provides high compressibility (up to 80% or more), while the thermally conductive skin layer (metal or ceramic coating) maintains high thermal conductivity. This composite approach resolves the contradiction by allowing the material to achieve both high thermal conductivity and high compressibility that cannot be obtained with single-material pads.
Solution Approach 2:
The patent changes the physical state and structural parameters of the thermal interface material by using a foam structure with controlled cell density and wall thickness. By adjusting these parameters, the material achieves optimal balance between compressibility and thermal conductivity, allowing significant compression while maintaining effective heat transfer pathways through the foam matrix and skin layer.
2Stability of the object's composition
If thermal connectors are made rigid to maintain structural stability, then stability improves, but ability to accommodate varying tolerances decreases
Solution Approach 1:
The patent uses a dynamic foam structure that can deform and adapt to varying gap sizes and surface irregularities. The foam's cellular structure allows it to compress and conform to different tolerances while maintaining structural integrity. This dynamic adaptability enables the same thermal interface device to accommodate multiple component configurations and tolerance ranges.
Solution Approach 2:
The foam-based thermal interface material acts as a flexible structure that can bend, compress, and conform to irregular surfaces. This flexibility allows the material to accommodate varying tolerances between components and heat sinks while maintaining stable thermal contact and structural stability during operation.
3Reliability
If compression is increased to reduce gap size, then thermal connection improves, but material durability decreases
Solution Approach 1:
The foam core absorbs compression forces through cellular collapse and deformation, protecting the thermally conductive skin layer from excessive stress. This composite structure allows high initial compression for improved thermal connection while the foam's elastic recovery properties maintain material durability over repeated compression cycles and extended operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution facilitates improved heat transfer with reduced thermal resistance and mechanical compatibility, enabling efficient heat dissipation and easy reworkability without additional processing steps, suitable for electronic assemblies with varying component configurations.
Implementation Method 1
The thermal interface device is configured to facilitate enhanced heat transfer between the heat source and the heat dissipater by providing a path with reduced thermal resistance
Implementation Method 2
The compliant nature of the thermal interface device accommodates mechanical and/or thermal growth and/or shrinkage of the heat dissipater and the heat source that may otherwise occur due to mismatch in coefficients of thermal expansions
Data Source
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AI summary
A thermal interface device (100) having a containment structure (102) and a thermal conductor (104) is provided. Further, the containment structure (102) includes at least one wall (106,107), where the containment structure (102) is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor (104) disposed at least in a portion of the containment structure (102). Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device (100) is a re-workable device.