Phase-Change Heat-Conductive Grease for Stable Clamping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thermally conductive materials face issues with printability defects and bolt loosening due to inappropriate viscosity, fluidity, and solvent residue, leading to inadequate heat dissipation and potential component damage.
Innovation Solution
A thermally conductive composition comprising inorganic powder fillers with specific particle diameter ratios, a wax-based resin with a melting point of 40°C to 150°C, and a rosin-based resin, along with a volatile solvent, to maintain shape and prevent bolt loosening while ensuring effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal grease is used to improve heat dissipation by filling gaps, then thermal resistance is reduced, but pump-out occurs during repeated heating and cooling cycles
Solution Approach 1:
The invention utilizes phase transition of the thermally conductive composition from solid at room temperature to liquid at operating temperature. The composition remains solid during assembly and transport, preventing pump-out, then melts at operating temperature to fill gaps and improve thermal contact between heat-generating components and heat sinks.
Solution Approach 2:
The invention changes the physical state parameter of the thermally conductive composition based on temperature. At room temperature, the composition maintains high viscosity/solid state for stable positioning; at operating temperature, it transitions to liquid state for optimal thermal contact, thus resolving the contradiction between position stability and heat dissipation efficiency.
2Reliability
If phase change material is used to reduce thermal resistance through softening, then adhesion to substrate is improved, but printing onto fine structures or patterns becomes difficult
Solution Approach 1:
The invention applies phase transition to enable the composition to be solid at room temperature for easy handling and printing, then transitions to liquid at operating temperature to achieve excellent thermal contact and adhesion to substrates, resolving the contradiction between printability and thermal contact quality.
Solution Approach 2:
By changing the temperature parameter, the composition transitions between solid and liquid states. At room temperature, it maintains solid form for precise printing; at operating temperature, it becomes liquid to conform to substrate surfaces, thus achieving both good printability and thermal contact.
3Reliability
If thermally conductive composition is softened by heating to improve thermal contact, then adhesion is enhanced, but fluidity increases causing bolt loosening
Solution Approach 1:
The invention uses phase transition to achieve controlled softening at operating temperature for thermal contact improvement, while maintaining solid state during assembly to ensure stable clamping force. The composition transitions from solid to liquid at the phase change point, enabling thermal contact enhancement without premature bolt loosening.
Solution Approach 2:
By controlling the temperature parameter and phase change point, the composition remains solid during assembly to maintain clamping force, then transitions to liquid at operating temperature to improve thermal contact, thus resolving the contradiction between thermal contact quality and clamping force stability.
4Ease of manufacture
If volatile solvent is added to convert composition to paste-like form for printing, then printability is improved, but printing defects such as blurring or smearing may occur
Solution Approach 1:
The invention utilizes phase transition to maintain the composition in solid form during printing operations, eliminating the need for volatile solvents. This prevents printing defects like blurring or smearing while maintaining excellent printability through controlled solid-state application, then transitions to liquid state after printing for optimal thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves stable clamping without bolt loosening, excellent printability, and efficient heat dissipation, maintaining adhesion and reliability in electronic components.
Implementation Method 1
a heat-dissipating component such as a heat sink made of aluminum, copper, or other metal material with high thermal conductivity is installed, to dissipate heat generated from heat-generating components
Implementation Method 2
a phase change material (PCM), which remains solid at room temperature but softens upon absorbing heat after being incorporated into heat-generating components
Implementation Method 3
softens upon absorbing heat after being incorporated into heat-generating components
Implementation Method 4
it is necessary to dry the grease after printing to remove the volatile solvent
Data Source
AI summary
[Subject] To provide a thermally conductive composition excellent in heat dissipation performance and free from bolt loosening [Measures for solution] The thermally conductive composition contains a first inorganic powder filler with a mean particle diameter of 10 to 100 µm, a second inorganic powder filler with a mean particle diameter of 1 to 50 µm, and a third inorganic powder filler with a mean particle diameter of 0.1 to 5 µm, wherein the mean particle diameter ratio of the second inorganic powder filler to the first inorganic powder filler is 0.8 or less, the mean particle diameter ratio of the third inorganic powder filler to the second inorganic powder filler is 0.6 or less, and wherein, relative to 100 vol% of the entire inorganic powder filler, a content of the first inorganic powder filler is 40 to 80 vol%, a content of the second inorganic powder filler is 10 to 50 vol%, and a content of the third inorganic powder filler is 10 to 40 vol%; and further contains a base oil, a wax-based resin with a penetration of 5 or more and a melting point of 40 to 150°C, and a rosin-based resin with a melting point of 40 to 150°C, wherein, relative to 100 parts by volume of the total content of the wax-based resin and the rosin-based resin, a content of the base oil is 100 to 1000 parts by volume, and a content of the wax-based resin is 10 to 60 vol%.