Phase Change Thermal Interface for Immersion Cooling
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Solution Overview
Problem
Conventional thermal interface materials (TIMs) used in information handling systems, such as silicone-based materials, introduce significant thermal resistance and are impractical for immersion cooling applications, as they can dissolve in coolants, necessitating improved cooling solutions that reduce thermal contact resistance and function effectively in immersion environments.
Innovation Solution
A fluid-based thermal interface assembly is introduced, featuring a sealed interstitial cavity between a heat dissipating device and a heat sink, filled with a working fluid that absorbs latent heat, evaporates at the heat releasing surface, and condenses back to liquid at the heat absorbing surface, reducing thermal contact resistance and enhancing heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional silicone-based thermal interface material is used, then thermal contact resistance is reduced, but the material dissolves in immersion cooling applications
Solution Approach 1:
The patent changes the physical and chemical parameters of the thermal interface material by using a phase change material with specific melting point and latent heat properties. The PCM is selected to remain stable in immersion cooling environments while providing effective thermal transfer through phase transition, thus resolving the contradiction between stability and thermal performance.
Solution Approach 2:
The patent utilizes phase transition of the thermal interface material from solid to liquid and back. The PCM absorbs latent heat during melting at the hot surface and releases heat during solidification at the cooler heat sink, providing superior thermal management compared to conventional TIMs while maintaining stability in immersion cooling.
2Productivity
If conventional silicone-based TIM is used, then thermal contact is established, but thermal resistance increases by up to 50% of total resistance
Solution Approach 1:
The phase change material utilizes latent heat absorption during melting and release during solidification to transfer heat from the hot surface to the heat sink. This phase transition mechanism provides much lower thermal resistance compared to conventional silicone-based TIMs, improving heat removal efficacy by utilizing the high latent heat of fusion of the PCM.
3Reliability
If thermal interface material is applied between heat sink and device, then thermal contact is improved, but the TIM adds thermal resistance to the system
Solution Approach 1:
The patent employs phase change material that transitions from solid to liquid at the hot device surface, absorbing latent heat, then condenses back to solid at the cooler heat sink surface, releasing heat. This phase transition cycle provides excellent thermal contact quality while minimizing thermal resistance, as the phase change process itself is an highly efficient heat transfer mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces thermal contact resistance, improving heat removal efficacy by approximately half compared to traditional silicone-based TIMs, while being suitable for immersion cooling environments, thus enhancing the cooling performance of electronic components in information handling systems.
Implementation Method 1
The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor when the liquid contacts the heat releasing surface
Implementation Method 2
The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor
Implementation Method 3
The working fluid has specific thermal properties that cause the fluid to (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink
Data Source
AI summary
An assembly for cooling a heat dissipating device reducing the thermal contact/interface resistance between a heatsink and a heat dissipating device includes: a heat dissipating device having a heat releasing surface; a heatsink having a heat absorbing surface; a gasket extending between the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity; and a working fluid provided within the cavity. The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor at the liquid surface in contact with the heat releasing surface during operation of the heat dissipating device and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink.