Phase-Change Thermal Peak Suppression for Semiconductor Chip Debugging
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Solution Overview
Problem
Current heat dissipation methods for semiconductor chips are inefficient during debugging processes, leading to overheating and potential damage due to limited heat dissipation efficiency.
Innovation Solution
A thermal peak suppression device comprising a heat dissipation fin set, a thermal conductive block with a closed cavity divided into hot and cold zones, a thermal phase change material, a filling gas, a fin-array frame, and a capillary tube, where the phase change material absorbs and discharges heat energy and the filling gas enhances heat transfer, facilitating efficient heat dissipation through phase transition and capillary action.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat dissipation methods are used for semiconductor chips during debugging, then the chip can be cooled, but the heat dissipation efficiency is limited and the chip may still overheat
Solution Approach 1:
The patent employs phase change material (PCM) that transitions between solid and liquid states to absorb and release heat energy. When the chip generates excessive heat, the PCM melts and absorbs latent heat, effectively suppressing temperature peaks. This phase transition mechanism provides superior heat dissipation efficiency compared to conventional passive heat sinks, directly resolving the contradiction between limited heat dissipation efficiency and chip overheating.
Solution Approach 2:
The patent introduces thermal conductive blocks as intermediary components between the chip and heat dissipation fins, and between the phase change material and heat dissipation system. These thermal conductive blocks efficiently transfer heat from the chip to the PCM and from the PCM to the heat dissipation fins, enhancing overall heat transfer efficiency and resolving the insufficient heat dissipation performance of conventional direct cooling methods.
2Productivity
If high heat energy is generated by semiconductor chips during debugging, then the chip can perform high-speed operations, but the chip may be overheated and destroyed
Solution Approach 1:
The phase change material is pre-positioned in thermal contact with the chip and heat dissipation system before debugging operations begin. When the chip starts generating heat during high-speed debugging, the PCM is already in place to immediately absorb the heat through phase transition, preventing temperature spikes that could cause damage. This preliminary preparation ensures both high productivity and reliability during debugging operations.
Solution Approach 2:
The phase change material acts as a thermal buffer or cushion between the heat-generating chip and the external environment. During high-speed debugging, the PCM absorbs excess heat energy through its phase transition, cushioning against temperature peaks that would otherwise threaten chip reliability. This beforehand cushioning mechanism protects the chip while allowing high-speed operations to proceed.
3Loss of energy
If thermal phase change material is used to absorb heat, then heat dissipation efficiency improves, but the device structure becomes more complex
Solution Approach 1:
The patent merges multiple functions into integrated components: the thermal conductive blocks serve both as structural support and heat transfer pathways, while also containing the phase change material. The heat dissipation fins are thermally coupled to the thermal conductive blocks, creating an integrated heat dissipation system. This merging approach achieves superior heat dissipation efficiency while minimizing the increase in device complexity compared to separate, modular components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses high heat energy generated by semiconductor chips, improving heat dissipation efficiency and reducing the risk of overheating, thereby protecting the chips during debugging processes.
Implementation Method 1
The thermal phase change material is disposed within the hot zone, and used to absorb and discharge heat energy by performing a phase transition between a liquid state and a solid state
Implementation Method 2
The thermal phase change material is disposed within the hot zone, and used to absorb and discharge heat energy by performing a phase transition between a liquid state and a solid state
Implementation Method 3
The first end and the second end of the capillary tube are respectively located within the cold zone and the hot zone. When the thermal phase change material is transformed into the liquid state, the thermal phase change material in the liquid state is sent to the hot zone of the closed cavity from the cold zone through the capillary tube
Implementation Method 4
The filling gas is disposed within the cold zone. A specific heat capacity of the filling gas is 2000 to 6000 joules/Kg·Kelvin
Implementation Method 5
The heat dissipator includes a thermal conductive block that is thermally coupled to the heat dissipation fin set
Data Source
AI summary
A thermal peak suppression device includes a heat dissipation fin set, a heat dissipator, a thermal phase change material, a filling gas, a fin-array frame and a capillary tube. The heat dissipator includes a thermal conductive block thermally coupled to the heat dissipation fin set, and a closed cavity formed inside the thermal conductive block to have a hot zone and a cold zone. The thermal phase change material is disposed within the hot zone. The filling gas is disposed within the cold zone. The fin-array frame is connected to the thermal conductive block within the cold zone. Two opposite ends of the capillary tube are respectively located within the cold zone and the hot zone. When the thermal phase change material is transformed into a liquid state, the thermal phase change material is sent to the hot zone through the capillary tube.