Phase Change Thermal Interface Material With Low Thermal Impedance

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Solution Overview

Problem

Existing phase change thermal interface materials (PCMs) exhibit high interface thermal resistance, limiting heat dissipation in high power devices, and novel TIMs like liquid metal and graphene face challenges with poor wettability and high cost, hindering their application and manufacturability.

Innovation Solution

A phase change thermal interface material (PC TIM) composed of thermally conductive fillers, phase change wax, coupling agents, polymer matrix materials, and additives, including aluminum powder, aluminum oxide, zinc oxide, and specific coupling agents, achieves low thermal impedance and improved manufacturability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional phase change materials are used, then reliability is improved, but interface thermal resistance increases

Engineering Contradiction:
ImprovereliabilityVSAvoidinterface thermal resistance
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent uses a composite material system consisting of phase change wax combined with thermally conductive fillers (aluminum powder, aluminum oxide, zinc oxide) and coupling agents. This composite structure maintains the reliability benefits of traditional PCMs while adding thermal conductivity pathways through the filler particles, thereby reducing interface thermal resistance to below 0.04° C. cm2/W.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the physical and chemical parameters of the phase change material by incorporating specific ratios of fillers (50-70 wt% aluminum powder, 19-30 wt% aluminum oxide, 1-9 wt% zinc oxide) and coupling agents. These parameter changes enhance thermal conductivity while maintaining the phase change properties, resolving the contradiction between reliability and thermal resistance.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If novel TIMs like liquid metal and graphene are used, then thermal conductivity is improved, but wettability deteriorates

Engineering Contradiction:
Improvethermal conductivityVSAvoidwettability
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The patent introduces coupling agents as intermediary substances between the thermally conductive fillers and the phase change wax matrix. These coupling agents improve the wettability and interfacial adhesion, allowing the high thermal conductivity fillers to be effectively integrated into the phase change material without suffering from the wettability problems that plague liquid metal and graphene applications.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If novel TIMs like liquid metal and graphene are used, then thermal conductivity is improved, but manufacturability deteriorates

Engineering Contradiction:
Improvethermal conductivityVSAvoidmanufacturability
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent replaces expensive novel materials like graphene and liquid metal with cost-effective traditional materials (aluminum powder, aluminum oxide, zinc oxide) that are readily available and easier to manufacture. This substitution maintains acceptable thermal conductivity performance while dramatically improving manufacturability and reducing cost, making the TIM suitable for mass production.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

4Productivity

If higher thermal performance is pursued, then heat dissipation is improved, but cost increases

Engineering Contradiction:
Improveheat dissipationVSAvoidcost
Core Design Contradiction:
ProductivityVSQuantity of substance

Solution Approach 1:

The patent optimizes the composition parameters by using a synergistic combination of fillers where aluminum powder provides base thermal conductivity, aluminum oxide enhances thermal stability, and zinc oxide contributes to thermal management. This balanced formulation achieves low thermal impedance (0.02-0.04° C. cm2/W) at a reasonable cost, avoiding the need for expensive novel materials while maintaining high heat dissipation performance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The PC TIM provides thermal impedance ranging from 0.02° C.cm2/W to 0.04° C.cm2/W, enhancing heat dissipation and manufacturability, while maintaining excellent thermal conductivity and reliability.

Implementation Method 1

The PC TIM provides thermal impedance ranging from 0.02° C.cm2/W to about 0.04° C.cm2/W, enhancing heat dissipation

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Phase change materials (PCM) as one of the traditional TIMs, show excellent thermal properties and reliability

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS20260028518A1Low thermal impedance phase change thermal interface materials
Publication Date: 2026.01.29 SOLSTICE ADVANCED MATERIALS US INC
  • US20260028518A1 patent drawing

AI summary

A phase change thermal interface material including a thermally conductive filler, a phase change wax, a coupling agent, and a polymer matrix material. The thermally conductive filler includes from about 50 wt. % to about 70 wt. % aluminum powder; from about 19 wt. % to about 30 wt. % aluminum oxide; and from about 1 wt. % to about 9 wt. % zinc oxide, based on the total weight of the phase change thermal interface material. The phase change thermal interface material has a thermal impedance from about 0.02° Ccm2/W to about 0.04° Ccm2/W, as determined by ASTM D5470.