Phase Modulation Module Structure for Potting Control and Heat Dissipation
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Solution Overview
Problem
The protrusion of potting material onto the effective region of a phase modulation element and the issue of heat dissipation in phase modulation elements, particularly due to increased heat generation, leading to potential changes in characteristics and damage such as decomposition or carbonization.
Innovation Solution
A phase modulation module design that includes a base portion, reflection-type phase modulation element, and holding portions with protruding structures and air-filled spaces to suppress potting material protrusion and enhance heat dissipation by forming a thermal path via the potting material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the phase modulation element modulates light with large average light amount, then the modulation capability is improved, but heat generation increases causing temperature rise and potential damage
Solution Approach 1:
The patent introduces a heat dissipation member as an intermediary between the phase modulation element and the housing. This heat dissipation member (having thermal conductivity of 10 W/m·K or more) acts as a thermal bridge to efficiently conduct heat away from the phase modulation element, preventing temperature rise while maintaining the element's ability to handle high power light modulation
Solution Approach 2:
The patent extracts the heat dissipation function from the housing structure and assigns it to a dedicated heat dissipation member. By separating the heat dissipation function into a specialized component with high thermal conductivity, the system can effectively manage heat generated during high-power operation without compromising the housing's other functions
2Reliability
If potting material is used to connect the phase modulation element, then the connection and sealing are improved, but the potting material may protrude onto the effective region of the optical element
Solution Approach 1:
The patent segments the connection structure by introducing a protrusion on the heat dissipation member that creates a dedicated space for the potting material. This segmentation confines the potting material to a specific region, preventing it from protruding onto the effective region of the phase modulation element while maintaining reliable connection
Solution Approach 2:
The patent performs preliminary action by pre-forming a protrusion structure on the heat dissipation member before applying the potting material. This protrusion pre-defines the boundary and space for the potting material, ensuring that during assembly the potting material is automatically contained within the effective region without requiring precise manual positioning
3Stability of the object's composition
If the phase modulation element is fixed securely to the base portion, then the structural stability is improved, but heat dissipation becomes insufficient due to increased heat generation
Solution Approach 1:
The patent merges the structural support function and heat dissipation function into a single integrated heat dissipation member. This member is fixed to both the phase modulation element and the housing, simultaneously providing mechanical stability while conducting heat away from the element through its high thermal conductivity structure
Solution Approach 2:
The heat dissipation member serves multiple functions: it provides structural support to stabilize the phase modulation element, acts as a thermal conductor to dissipate heat, and creates a mounting structure for the potting material. This multi-functionality resolves the contradiction by achieving both structural stability and heat dissipation efficiency through a single component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses potting material protrusion and improves heat dissipation by securing air spaces and forming efficient thermal paths, thereby preventing damage and maintaining module performance.
Implementation Method 1
air is disposed in at least a part of a portion of the first space overlapping the first protruding portion when viewed from a predetermined direction
Implementation Method 2
a thermal path via the potting material can be formed at a portion where a distance between the first holding portion and the phase modulation element is short, and heat generated in the phase modulation element can be efficiently transferred to the holding portion via the potting material
Data Source
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AI summary
A first holding portion includes a first side wall portion facing a first side surface of a phase modulation element, and a first protruding portion extending from the first side wall portion toward the phase modulation element. A second holding portion includes a second side wall portion facing a second side surface of the phase modulation element. An end surface of the first protruding portion faces the phase modulation element. A potting material connects an end surface of the first protruding portion and the first side surface to each other in a first space formed by the first side surface of the phase modulation element and the first side wall portion and the first protruding portion of the first holding portion. Air is disposed in at least a part of an overlapping portion of the first space overlapping the first protruding portion when view ed from a predetermined direction.