Phase Modulation Module Structure for Resin Control and Heat Dissipation
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Solution Overview
Problem
Existing phase modulation modules face challenges in controlling the application amount of sealing resin, which can lead to flow-out issues and heat dissipation problems due to temperature rise, potentially causing damage to the phase modulation element.
Innovation Solution
A phase modulation module design with a holding portion comprising side and top wall portions that restrict the filling material's arrangement, allowing efficient heat transfer and controlled application, featuring a cover member and heat sink for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing resin is used to fill the gap between the optical element and housing, then the optical element is sealed and protected, but the sealing resin may flow out to the effective region of the surface of the optical element during manufacturing, transportation, or use
Solution Approach 1:
The holding portion is divided into multiple functional walls: first and second side wall portions that face the side surfaces of the phase modulation element, and a top wall portion with an opening that overlaps the phase modulation element. This segmentation creates distinct regions for light passage and filling material containment, preventing the filling material from flowing onto the effective region while maintaining sealing protection.
2Productivity
If light with large average light amount is modulated by the phase modulation element, then the phase modulation function is achieved, but heat generation increases causing temperature rise that may lead to decomposition or carbonization of liquid crystal
Solution Approach 1:
The filling material serves as a thermal intermediary between the phase modulation element and the holding portion. It fills the space between them and provides a thermal conduction path, allowing heat generated during phase modulation to be efficiently transferred to the holding portion and dissipated, preventing temperature rise that would cause liquid crystal decomposition or carbonization.
3Productivity
If temperature rises during operation, then phase modulation can handle high light amounts, but the plane shape of the phase modulation element changes causing irreversible distortion in the phase pattern
Solution Approach 1:
The filling material acts as a thermal mediator that conducts heat away from the phase modulation element to the holding portion, maintaining the plane shape stability of the phase modulation element even during high-power operation, thereby preventing irreversible distortion in the phase pattern.
4Loss of energy
If the holding portion includes top wall portion with extending portions, then the filling material arrangement space is restricted and heat dissipation is improved, but the structure becomes more complex
Solution Approach 1:
The top wall portion with first and second extending portions serves multiple functions simultaneously: it restricts the filling material arrangement space to prevent flow-out, provides thermal conduction paths for heat dissipation, and maintains the structural integrity of the holding portion. This multi-functionality improves heat dissipation efficiency without proportionally increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively controls the filling material's application and improves heat dissipation, preventing flow-out and damage, while maintaining module integrity and functionality.
Implementation Method 1
the filling material connects the phase modulation element and the holding portion to each other in the first space and connects the phase modulation element and the holding portion to each other in the second space
Data Source
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AI summary
A phase modulation module includes a base portion, a phase modulation element, a holding portion including a first side wall portion, a second side wall portion, and a top wall portion, and a filling material. The top wall portion includes a first extending portion and a second extending portion. End surfaces of the first extending portion and the second extending portion face the phase modulation element. The filling material is disposed in each of a first space formed by a first side surface, the first side wall portion, and the top wall portion of the phase modulation element, and a second space formed by a second side surface, the second side wall portion, and the top wall portion of the phase modulation element, and connects the phase modulation element and the holding portion to each other in the first space and connects the phase modulation element and the holding portion to each other in the second space.