Phase-Separated LMO Cap Layers for HTS Flux Pinning
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Solution Overview
Problem
Current methods for producing phase-separated substrates for high-temperature superconductor films are non-scalable, cost-prohibitive, and industrially inefficient, limiting the large-scale production of high-quality HTS tapes and wires for commercial applications.
Innovation Solution
A method involving the deposition of a phase-separated layer comprising lanthanum manganate (LMO) and other metal oxides or nitrides on a biaxially-textured substrate using techniques like sputtering, pulsed laser deposition, or metal organic chemical vapor deposition, which creates a substrate with defects that enhance flux pinning in superconducting films, reducing critical current density losses in magnetic fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical vapor deposition (PVD), metal organic deposition, pulsed laser deposition (PLD), molecular beam epitaxy (MBE), chemical vapor deposition (CVD), metal-organic chemical vapor deposition (MOCVD) or atomic layer deposition (ALD) is used to produce phase-separated substrates, then pinning defects can be introduced into superconducting films, but the manufacturing process becomes non-scalable, cost-prohibitive, and industrially inefficient
Solution Approach 1:
The substrate is segmented into multiple domains with different crystallographic orientations (e.g., a-domain and c-domain regions) through controlled deposition conditions. This segmentation creates phase-separated regions that serve as pinning defect sites, improving critical current density without requiring complex post-processing steps that would reduce productivity
Solution Approach 2:
Deposition parameters such as oxygen partial pressure, deposition temperature, and laser fluence are changed during the deposition process to induce phase separation. By dynamically adjusting these parameters, the substrate develops regions with different properties that enhance flux pinning, achieving improved reliability while maintaining a single-step deposition process for high productivity
2Object-affected harmful factors
If phase-separated substrates are produced using conventional deposition techniques, then pinning defects are introduced to reduce current density losses in magnetic fields, but the process becomes cost-prohibitive and non-scalable
Solution Approach 1:
The deposition process itself generates the phase-separated structure with pinning defects through self-organization mechanisms. The system uses inherent instabilities during deposition to automatically create the desired defect structure, eliminating the need for separate, costly defect-introduction steps and enabling scalable manufacturing
Solution Approach 2:
The substrate is created as a composite material with multiple phases (e.g., LMO and Al2O3 phases) that have different properties. This composite structure provides both the structural integrity needed for manufacturing and the pinning defects needed to reduce current density losses, achieving both improved performance and ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of HTS tapes and wires with improved critical current densities and reduced AC loss, making them more suitable for industrial applications by integrating phase-separated cap layers that introduce nucleation sites and defects, thereby enhancing the stability of superconducting films in external magnetic fields.
Implementation Method 1
The pinning defects have been found to significantly reduce current density losses in superconductor films in the presence of an external magnetic field
Implementation Method 2
techniques like sputtering, pulsed laser deposition, or metal organic chemical vapor deposition
Implementation Method 3
techniques like sputtering, pulsed laser deposition, or metal organic chemical vapor deposition
Implementation Method 4
techniques like sputtering, pulsed laser deposition, or metal organic chemical vapor deposition
Data Source
AI summary
An electronic component that includes a substrate and a phase-separated layer supported on the substrate and a method of forming the same are disclosed. The phase-separated layer includes a first phase comprising lanthanum manganate (LMO) and a second phase selected from a metal oxide (MO), metal nitride (MN), a metal (Me), and combinations thereof. The phase-separated material can be an epitaxial layer and an upper surface of the phase-separated layer can include interfaces between the first phase and the second phase. The phase-separated layer can be supported on a buffer layer comprising a composition selected from the group consisting of IBAD MgO, LMO/IBAD-MgO, homoepi-IBAD MgO and LMO/homoepi-MgO. The electronic component can also include an electronically active layer supported on the phase-separated layer. The electronically active layer can be a superconducting material, a ferroelectric material, a multiferroic material, a magnetic material, a photovoltaic material, an electrical storage material, and a semiconductor material.