Phase Shift Mask With Metal Coating Layer
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Solution Overview
Problem
Current phase shift masks used in photolithography struggle to individually adjust the degree of phase change and transmittance, which limits their ability to keep pace with the miniaturization of semiconductor patterns, and their manufacturing process is complex and costly.
Innovation Solution
A phase shift mask comprising a transparent substrate with a polymer phase shift pattern and a metal coating layer, where the metal coating layer is applied using an electroless plating process, allowing for adjustable transmittance and phase change, and simplifying the manufacturing process by eliminating separate etching and strip processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a CrO or Mosi film is used to form the phase shift mask, then the phase shift mask can be manufactured, but it becomes difficult to individually adjust the degree of phase change and the degree of transmittance
Solution Approach 1:
The invention divides the phase shift mask into two separate functional layers: a phase shift layer (made of polymer or organic material) that controls phase change, and a metal coating layer (such as Al, Mo, or W) that controls transmittance. This segmentation allows independent adjustment of each parameter - the phase shift layer thickness controls phase change degree, while the metal coating layer thickness controls transmittance degree, resolving the contradiction between adaptability and manufacturing complexity.
Solution Approach 2:
The invention uses composite materials by combining a polymer/organic phase shift layer with a metal coating layer. The phase shift layer provides the necessary phase change properties while the metal coating layer provides transmittance control. This composite structure enables independent optimization of both phase change and transmittance parameters without the manufacturing complexity associated with single-material systems like CrO or Mosi films.
2Reliability
If the phase shift mask uses CrO or Mosi film, then it can provide phase shift function, but the manufacturing process becomes complex and costly
Solution Approach 1:
By segmenting the mask into a phase shift layer and a separate metal coating layer, the invention simplifies the manufacturing process. The phase shift layer can be formed through standard photolithography and etching processes, while the metal coating layer is applied through sputtering or evaporation. This segmentation eliminates the need for complex single-step CrO or Mosi film processing, reducing device complexity while maintaining reliable phase shift function.
Solution Approach 2:
The invention changes the material parameters by using polymer or organic materials for the phase shift layer instead of CrO or Mosi films. This parameter change allows the use of more accessible and simpler manufacturing processes such as standard photolithography and sputtering, thereby reducing manufacturing process complexity while maintaining the essential phase shift function through controlled layer thickness.
3Manufacturing precision
If the metal coating layer is applied entirely on the phase shift pattern surface, then uniform thickness can be achieved, but the side surface coverage may affect light penetration
Solution Approach 1:
The invention applies the metal coating layer selectively to different regions of the phase shift pattern with different thicknesses or coverage areas. The upper surface receives full metal coating coverage for uniformity, while the side surfaces may have reduced or no metal coating to maintain light penetration. This local quality approach allows simultaneous achievement of manufacturing precision for uniform coating and adequate illumination intensity for light penetration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves resolution in photolithography, allows for easier adjustment of permeability and phase change, and simplifies the manufacturing process, enabling more precise control over micro pattern formation.
Implementation Method 1
a phase shift pattern arranged on the transparent substrate to change a phase of light that penetrates the transparent substrate
Implementation Method 2
forming a metal coating layer on at least a part of a surface of the phase shift pattern through an electroless plating process
Data Source
AI summary
A phase shift mask enables much smaller scale of electronic circuit pattern. A phase shift mask comprises a transparent substrate, a phase shift pattern arranged on the transparent substrate to change a phase of light that penetrates the transparent substrate, and a metal coating layer arranged on at least a part of a surface of the phase shift pattern.