Integrated Phase Terminal Heat Sink for Electronic Cut-Off Assembly

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Solution Overview

Problem

Existing electronic cut-off protection devices with heat sinks face challenges in efficiently dissipating heat without modifying the housing material and simplifying assembly operations, while also optimizing thermal conduction and reducing electrical junctions.

Innovation Solution

The electronic cut-off protection device incorporates a single-piece conductive part that extends from the phase connection terminal to form both a part of the phase current line and a heat sink, ensuring electrical and thermal connection to the electronic cut-off unit for efficient heat dissipation by thermal conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat sink is arranged in the housing opposite the rear side face made of metallic material, then heat dissipation is optimized, but the housing material must be modified from plastic to metal

Engineering Contradiction:
Improveheat dissipationVSAvoidhousing material modification
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent merges the phase connection terminal and heat sink into a single integrated conductive component. This eliminates the need to modify the housing material while achieving efficient heat dissipation, as the integrated terminal serves both electrical connection and thermal management functions simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The phase connection terminal serves dual purposes: electrical connection and heat dissipation. By making the terminal itself the heat sink through its conductive properties and geometric configuration, the system uses existing components for thermal management without requiring additional housing material changes.

Inventive Principle:
Principle #25Self-service

2Temperature

If conductive plates are used to dissipate thermal energy by conduction along electrical phase conductors, then thermal energy dissipation is improved, but assembly operations become tedious and meticulous

Engineering Contradiction:
Improvethermal energy dissipationVSAvoidassembly operations
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent integrates the heat sink functionality directly into the phase connection terminal structure, eliminating the need for separate conductive plates. This integration removes multiple assembly steps and meticulous positioning requirements while maintaining effective thermal conduction through the unified conductive path.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the heat dissipation function from separate conductive plates and incorporates it into the phase connection terminal itself. This extraction simplifies the overall structure by removing unnecessary intermediate components and their associated assembly complexities.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of operation

If multiple separate components are used for phase current line and heat sink, then assembly flexibility is maintained, but the number of electrical junctions increases

Engineering Contradiction:
Improveassembly flexibilityVSAvoidnumber of electrical junctions
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent combines the phase connection terminal and heat sink into a single integrated conductive component, reducing the number of electrical junctions and connection points. This integration maintains assembly flexibility through modular design while eliminating unnecessary junctions between separate components.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration simplifies assembly, enhances thermal conduction, reduces the number of electrical junctions, and minimizes the impact on the housing material, thereby optimizing the overall impedance and performance of the protection device.

Implementation Method 1

dissipate the heat coming from said at least one electronic power cut-off component at least by thermal conduction

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

conduct the current coming from said electronic cut-off unit and/or to said electronic cut-off unit

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP4564391A1Electronic break protection apparatus with heat sink
Publication Date: 2025.06.04 HAGER NEXT
  • EP4564391A1 patent drawingFigure 1
  • EP4564391A1 patent drawingFigure 2
  • EP4564391A1 patent drawingFigure 3

AI summary

The invention relates to an electronic cut-off protection device comprising: a housing (1), a phase current line (P) between a first phase connection terminal (2) and a second phase connection terminal (3), the first/second phase connection terminal (2, 3) comprising a conductive part (4) comprising a contact portion (5), an electronic cut-off unit (6) comprising at least one electronic power cut-off component (7), a heat sink (8), characterized in that: - the conductive part (4) of the first phase connection terminal (2) is extended by a phase conductive portion (9) forming on the one hand a first part of the phase current line (P) and on the other hand a heat sink (8), the conductive part (4) and the phase conductive portion (9) forming a single-piece conductive part (10),- the phase conductive portion (9) being electrically and thermally connected to said electronic cut-off unit (6) so as to dissipate the heat coming from said at least one electronic power cut-off component (7) by thermal conduction and to conduct the current coming from said electronic cut-off unit (6) and/or to said electronic cut-off unit (6).,