Phase Transition Substrate Carrier for Film Deposition Heat Management
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Solution Overview
Problem
Conventional substrate carrier units in film deposition apparatuses face challenges in efficiently dissipating heat generated during the sputtering process, leading to potential deformation or damage of the substrate due to inadequate heat dissipation capacity.
Innovation Solution
A substrate carrier unit incorporating a phase transition material with a melting point between 18° C. and 95° C., which absorbs thermal energy as latent heat and expands, is used within an isolated space to enhance heat dissipation, utilizing materials like hydrocarbons or hydrated salts to increase heat storage capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the deposition time is shortened and deposition efficiency is increased, then productivity is improved, but the temperature inside the deposition chamber increases excessively causing substrate damage
Solution Approach 1:
The patent applies phase transition of paraffin wax (solid to liquid) as a heat absorption mechanism. The phase change material absorbs excessive thermal energy from the substrate carrier through latent heat absorption during melting, thereby controlling substrate temperature while enabling faster deposition cycles and improved productivity
Solution Approach 2:
The patent changes the thermal properties of the substrate carrier system by introducing a material with high latent heat capacity (paraffin wax). This parameter change in heat absorption capability allows the system to handle higher energy inputs during deposition without proportionally increasing substrate temperature, thus enabling higher productivity
2Temperature
If conventional high thermal conductivity materials (metal tray and transport belt) are used for heat dissipation, then heat conduction is improved, but the heat capacity is insufficient limiting heat dissipation efficiency
Solution Approach 1:
The patent creates a composite heat management system combining conventional high thermal conductivity materials (metal tray and transport belt) with a high heat capacity phase change material (paraffin wax). This composite approach leverages both thermal conduction and latent heat absorption mechanisms, achieving superior heat dissipation efficiency that neither material could achieve alone
Solution Approach 2:
The patent merges two different heat management mechanisms: thermal conduction through metal materials and latent heat absorption through phase transition material. By combining these approaches in the substrate carrier unit, the system achieves both efficient heat transfer and high heat capacity, resolving the limitation of insufficient heat storage in conventional systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The phase transition material effectively reduces the maximum substrate temperature by absorbing and storing thermal energy, improving thermal dissipation efficiency and preventing substrate damage, with a heat storage capacity ranging from 134 to 250 kJ/kg.
Implementation Method 1
The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid
Implementation Method 2
The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid
Data Source
AI summary
A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.