Phased Array Antenna Layered Architecture Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Wide scanning Q-band phased array antennas face challenges in heat dissipation and microwave signal distribution due to the small size of antenna elements and high frequency requirements, leading to inefficiencies in cooling and signal transmission.
Innovation Solution
A layered architecture for the antenna core comprising radio frequency modules, a heat conductive mounting layer for cooling, and a signal distribution layer for efficient signal transmission, with separate layers for control, mounting, and signal distribution to improve heat removal and reduce signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antenna elements are placed in a grid pattern with pitch of approximately one-half of the wavelength to achieve wide scanning capability, then beam scanning performance is improved, but heat dissipation becomes difficult due to small element size and high density
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by implementing cooling channels that extend through the substrate thickness. This vertical dimension allows heat to be removed from the dense antenna element array through pathways perpendicular to the element plane, effectively addressing the heat accumulation problem caused by high-density grid placement.
Solution Approach 2:
The patent introduces a substrate with integrated cooling channels as an intermediary structure between the antenna elements and the cooling fluid. This substrate acts as a heat transfer medium that conducts heat away from the antenna elements through the cooling channels, enabling effective thermal management of the high-density element array.
2Adaptability or versatility
If high frequency microwave signals are distributed to all elements to achieve wide scanning Q-band performance, then beam scanning range is improved, but signal loss increases due to excessive distribution path length
Solution Approach 1:
The patent divides the antenna array into multiple independent or semi-independent modules, each with its own local signal distribution network. This segmentation reduces the path length for microwave signal distribution within each module, minimizing signal loss while maintaining the overall wide scanning capability through coordinated operation of multiple modules.
Solution Approach 2:
The patent employs a three-dimensional signal distribution architecture where signal paths are routed through vertical channels and layers within the substrate rather than only horizontal paths. This vertical routing dimension shortens the effective signal distribution path length, reducing attenuation for high-frequency Q-band signals while still reaching all antenna elements.
3Device complexity
If MMIC chips are used for signal processing and amplification with element size on the same order as chip size, then integration density is improved, but hermetic packaging becomes challenging
Solution Approach 1:
The patent integrates the antenna elements, MMIC chips, and cooling channels into a single monolithic substrate structure. This merging of multiple functions (radiation, signal processing, and thermal management) into one integrated component eliminates the need for separate hermetic packaging of individual chips, simplifying manufacturing while maintaining high integration density.
Solution Approach 2:
The patent uses a composite substrate structure that combines dielectric materials for signal transmission with thermally conductive materials for heat dissipation. This composite construction allows the substrate to simultaneously support MMIC chips, guide microwave signals, and provide thermal pathways, reducing packaging complexity while maintaining integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more efficient heat removal and signal distribution, resulting in lower operating temperatures and reduced signal loss, allowing for scalable and flexible antenna designs with improved performance.
Implementation Method 1
The plurality of radio frequency modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of radio frequency modules
Data Source
Figure 1~2
Figure 3~5
Figure 4
AI summary
An antenna array core comprising a plurality of microwave modules, a control layer, a mounting layer, and a signal distribution layer. The control layer is capable of distributing control signals to the plurality of microwave modules. The plurality of microwave modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of microwave modules. The signal distribution layer is located below the mounting layer, wherein the signal distribution layer is capable of transmitting microwave signals to the plurality of microwave modules and wherein the arrangement of the plurality of microwave modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core. The architecture is a balance between, size, thermal control, manufacturability, cost, and performance so as to be a unique solution.