Phased Array Antenna Using Gap Waveguide Posts
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Solution Overview
Problem
Existing phased array antennas face challenges such as high costs, limited space for electronics, thermal limitations, and difficulties in incorporating filtering due to the need for shielding and coaxial connections, which restrict their use in commercial applications.
Innovation Solution
A phased array antenna design utilizing a low-loss multilayer gap waveguide structure with a base layer of protruding posts that suppress wave propagation, allowing for efficient electrical coupling and thermal management, eliminating the need for shielding walls and enabling higher power handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If tile building practice is used to integrate antenna with electronics, then integration is easier, but space for electronics is limited and shielding walls are required
Solution Approach 1:
The invention transitions from planar PCB mounting to three-dimensional cavity integration. The antenna elements are positioned within cavities formed by the base layer and metal posts, allowing vertical stacking and multi-layer integration. This enables electronics to be mounted on both top and bottom surfaces of the substrate, effectively doubling the available space while maintaining compact form factor.
Solution Approach 2:
The invention implements nested integration where antenna elements, feeding networks, and electronic components are arranged in multiple nested layers. The cavities between metal posts contain feeding structures, while the substrate surfaces mount electronics. This nested arrangement maximizes space utilization by occupying three-dimensional volume rather than just planar area.
2Reliability
If shielding walls are added for isolation between channels, then channel isolation is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The invention extracts the shielding function from separate physical walls and implements it through the inherent electromagnetic properties of the metal post array and cavity structure. The conductive posts and cavity boundaries naturally provide electromagnetic isolation between adjacent channels through reflection and absorption, eliminating the need for additional shielding materials and complex shielding structures.
Solution Approach 2:
The metal posts and cavity structures serve multiple functions simultaneously: they provide mechanical support for antenna elements, create resonant cavities for signal confinement, provide electromagnetic shielding between channels, and serve as ground references for the feeding networks. This multi-functionality reduces overall device complexity by consolidating multiple requirements into single structural elements.
3Area of stationary object
If electronics are tightly crowded to maximize space utilization, then area efficiency is improved, but thermal management becomes difficult
Solution Approach 1:
The invention segments the electronics mounting into separate thermal zones using the cavity structures and metal post arrays. Each cavity acts as a thermal compartment that can be independently managed, allowing heat from high-power components to be directed to dedicated thermal vias and heat sinks without affecting adjacent low-power components. This segmentation enables effective thermal management despite high component density.
Solution Approach 2:
The invention introduces thermal vias, heat spreaders, and thermal interface materials as intermediary elements between power-generating components and the substrate. These thermal intermediaries conduct heat away from crowded electronic components through the substrate to external heat sinks, maintaining operational temperatures even when components are tightly packed for maximum area efficiency.
4Reliability
If coaxial connectors are used for antenna connections, then connection reliability is improved, but cost and bulkiness increase
Solution Approach 1:
The invention replaces mechanical coaxial connectors with integrated microstrip and stripline transmission lines etched directly onto the substrate. These planar transmission lines provide reliable RF signal transmission without requiring external connectors, reducing both manufacturing cost and assembly complexity while maintaining connection reliability through precise controlled impedance design.
Solution Approach 2:
The invention merges the connector function into the substrate itself by integrating feeding networks and transmission lines directly onto the board. The antenna elements are fed through integrated microstrip lines that extend from the radiating elements to edge launch points or integrated connectors, eliminating the need for separate coaxial connector assemblies and reducing overall system bulkiness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves cost-effective production, efficient use of space, improved thermal management, and higher power handling capabilities, enabling broader application in telecommunications and radar systems.
Implementation Method 1
The new phased array antenna solves a number of the inherent problems previously experienced in the tile antenna building practice by using one or several layers of gap waveguide technology.
Implementation Method 2
The protruding posts form a gap Artificial Magnetic Conductor (AMC) surface. The base layer with the protruding posts preferably covers the complete area of the PCB. The effect of this base layer is a total suppression of any wave propagation along or inside the PCB
Data Source
AI summary
A phased array is disclosed, including: a base layer including a substrate with a plurality of protruding posts, for stopping wave propagation along the base layer, and a printed circuit board (PCB) arranged on the base layer, and including at least one phased array radio frequency (RF) integrated circuit (IC) on a first side of the PCB facing the base layer and the protruding posts. The PCB further includes feeds for transferring of RF signals from the phased array RF IC(s) to an opposite second side of the PCB. A radiating layer, including a plurality of radiating elements for transmitting and/or receiving RF signals from the phased array antenna is also provided, together with a feeding layer for transfer of RF signals, arranged between the feeds of the PCB on the second side and the radiating elements of the radiating layer.