Phased Array Signal Conditioning Module With Ground-Plane Isolation
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Solution Overview
Problem
Phased array antennas face challenges in achieving increased bandwidth while maintaining high main lobe to side lobe power ratio, and require reduced weight, size, and manufacturing cost, along with lower power requirements, which existing technologies struggle to address effectively.
Innovation Solution
A phased array antenna system is designed with a signal conditioning module that includes a support structure, signal conditioning elements, and coupling elements, where the signal conditioning module is coupled to both the antenna elements and the carrier, utilizing a ground plane for electromagnetic isolation and shielding to enhance performance and reduce size and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional phased array antenna designs are used, then the antenna can transmit and receive signals in a preferred direction, but the bandwidth is limited and the main lobe to side lobe power ratio cannot be maintained at high levels
Solution Approach 1:
The antenna system is divided into multiple independent antenna elements arranged in a phased array configuration, each element capable of independent signal processing. This segmentation allows the system to achieve broader bandwidth by operating across multiple frequency bands while maintaining beamforming capabilities through digital signal processing of each element's signal separately.
Solution Approach 2:
The phased array employs dynamic beamforming techniques where the phase and amplitude of signals from each antenna element are dynamically adjusted in real-time through electronic control. This dynamic adjustment allows the main beam to be steered and shaped adaptively across different frequencies, maintaining high main lobe to side lobe ratios throughout the extended bandwidth range.
2Ease of operation
If conventional phased array antenna structures are implemented, then directional signal transmission and reception is achieved, but the weight, size, and manufacturing cost increase
Solution Approach 1:
Multiple antenna elements and their associated signal conditioning circuits are integrated onto a single substrate or carrier board, combining what would traditionally be separate components into a unified structure. This integration significantly reduces the overall weight and footprint of the antenna system while maintaining the phased array's directional signal capabilities through coordinated operation of the integrated elements.
Solution Approach 2:
The antenna elements and signal conditioning circuits are arranged in a planar configuration on a two-dimensional substrate, transitioning from a three-dimensional stacked architecture. This planar integration reduces the vertical height and overall volume of the antenna system, making it more suitable for applications with space constraints while preserving directional beamforming functionality.
3Ease of operation
If conventional phased array antenna structures are implemented, then directional signal transmission and reception is achieved, but the manufacturing cost increases
Solution Approach 1:
The substrate serving as the carrier for antenna elements also functions as the ground plane and provides mechanical support, eliminating the need for separate structural components. Additionally, the same substrate infrastructure supports multiple antenna elements and their signal conditioning circuits, allowing a single manufacturing process to produce the entire phased array assembly, thereby reducing overall manufacturing cost.
Solution Approach 2:
By transitioning to a planar two-dimensional layout where all antenna elements and signal conditioning circuits reside on a single substrate layer, the manufacturing process can utilize standard printed circuit board fabrication techniques. This approach enables economies of scale through batch production and reduces assembly complexity compared to three-dimensional stacked architectures requiring multiple alignment and bonding steps.
4Ease of operation
If conventional phased array antenna structures are implemented, then directional signal transmission and reception is achieved, but the power requirements increase
Solution Approach 1:
A ground plane is introduced as an intermediary structure between the antenna elements and the signal conditioning circuits. This ground plane serves multiple functions: it provides electromagnetic shielding to reduce interference and signal degradation, improves impedance control for more efficient power transfer, and acts as a reference potential that stabilizes power consumption across all signal processing operations in the phased array system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved bandwidth and reduced size and weight of phased array antennas, while maintaining high signal quality and reducing manufacturing costs, by effectively managing signal conditioning and electromagnetic isolation.
Implementation Method 1
utilizing a ground plane for electromagnetic isolation and shielding to enhance performance and reduce size and weight
Data Source
AI summary
In some embodiments, a phased array antenna system includes a carrier having a first side and a second side opposite the first side; a first antenna element and a second antenna element coupled to the first side of the carrier, the second antenna element spaced apart from the first antenna element by a space and a signal conditioning module including a support structure having a first side and a second side opposite the first side, one or more signal conditioning elements coupled to the first side of the support structure, and a plurality of coupling elements coupled to the second side of the support structure, wherein at least one of the plurality of coupling elements electrically couples the signal conditioning module to the first antenna element; and at least another of the plurality of coupling elements electrically couples the signal conditioning module to the carrier.