Phased Array Antenna with Integrated Radiating Elements
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Solution Overview
Problem
Conventional phased array antenna systems face challenges in operating at high frequencies due to limitations in manufacturing yield, thermal performance, weight, reliability, and cost, particularly in tile array configurations, and are hindered by numerous cables and connectors in brick array configurations.
Innovation Solution
The development of phased array antenna systems with a reduced number of layers in printed wiring boards, incorporating an H form beam combiner and integrated radiating elements, which reduces insertion losses and eliminates the need for many cables and connectors, enhancing thermal dissipation and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If amplifier modules are oriented perpendicularly to the bore-sight in tile array configuration, then the physical dimensions of amplifier modules are limited to the lattice spacing of the array, but this becomes problematic at higher frequencies where lattice spacing decreases
Solution Approach 1:
The patent transitions from a conventional tile array configuration where amplifier modules are oriented perpendicularly to the bore-sight to a new configuration where amplifier modules are oriented parallel to the bore-sight. This dimensional reorientation allows amplifier modules to extend beyond the lattice spacing constraints, enabling operation at higher frequencies where traditional perpendicular orientation would require impractically small module dimensions.
2Device complexity
If a large number of layers are used in PWB to implement Wilkinson combiner network, power lines, control lines, and radiating elements, then the system can be fully integrated, but manufacturing yield decreases due to increased likelihood of defective vias or transmission lines
Solution Approach 1:
The patent divides the PWB into multiple functional layers with specific assignments: radiating elements on outer layers, RF signal distribution on intermediate layers, and power/control on remaining layers. This segmentation allows each layer to be optimized independently and reduces the total number of layers required compared to conventional integrated designs, thereby reducing via count and improving manufacturing yield.
Solution Approach 2:
The patent utilizes the vertical dimension of the PWB structure more effectively by placing radiating elements on outer layers and distributing RF signals through intermediate layers. This three-dimensional arrangement reduces the need for excessive layer stacking, minimizing via density and transmission line complexity while maintaining full system integration.
3Device complexity
If numerous vias and transmission lines are present within PWB layers, then system integration is achieved, but the likelihood of defective vias or transmission lines increases, making reworking difficult
Solution Approach 1:
By segmenting the PWB into distinct functional layers with radiating elements on outer layers and RF distribution on intermediate layers, the patent reduces via density within any single layer. This segmentation minimizes the concentration of potential defect points and simplifies troubleshooting and rework procedures.
4Power
If PWB materials are used for heat dissipation, then thermal gradients are produced within PWB layers, but this limits power handling capability
Solution Approach 1:
The patent extracts the heat dissipation function from the PWB material itself by placing cooling channels and thermal management structures in direct contact with amplifier modules. This separation allows the PWB to focus on electrical functions while dedicated thermal pathways handle heat removal, enabling higher power operation without excessive thermal gradients.
Solution Approach 2:
The patent introduces cooling channels and thermal interface materials as intermediary structures between amplifier modules and the external cooling system. These intermediaries provide efficient thermal pathways that bypass the limitations of PWB materials, allowing high power levels to be sustained without creating damaging thermal gradients within the PWB layers.
Data Source
AI summary
Embodiments include phased array antenna apparatus and methods of manufacturing them. In an embodiment, a phased array antenna apparatus includes at least one printed wiring board (PWB) (1002, FIG. 10) having multiple layers, at least one beamformer module (1014) with at least one beam combiner/divider, at least one amplifier (1016), and at least one integral radiating element (1006). The PWB includes RF manifolds (912, 916, FIG. 9) embedded within the multiple layers between corresponding ports (910, 914) of the beam combiners/dividers. The at least one integral radiating element is located proximate to an edge of the PWB and oriented in parallel with a bore-sight of the phased array antenna apparatus. In an embodiment, the beam combiners/dividers may include an H form combiner (704, FIG. 7). An opening (1026, FIG. 10) in the PWB is adapted to enable the amplifier to directly contact a heat sink (1004), in an embodiment.