Broadband Phased Array Monoliths for Low-Profile Dual Polarization

The antenna element is divided into multiple thin metallic layers separated by dielectric spacers, creating a segmented structure that maintains broadband radiation capability while reducing overall thickness. Each layer contributes to the radiation function, allowing the element to achieve the necessary electrical length without increasing physical profile.

Multiple metallic layers are nested within each other with dielectric spacers in between, creating a compact multi-layer configuration. This nesting approach allows the antenna to achieve the required electrical dimensions for broadband operation while maintaining a thin physical profile suitable for low-cost fabrication.

The dual-polarization capability is achieved by segmenting the antenna element into multiple functional layers, where different layers support different polarization modes. This segmentation eliminates the need for complex egg-crate structures while maintaining dual-polarization performance and improving manufacturability.

The multi-layer metallic structure serves multiple functions simultaneously: it provides dual-polarization capability, maintains mechanical robustness through layer stacking, and enables low-cost fabrication using standard PCB techniques. Each layer contributes to both structural integrity and radiation function.

The impedance transformation function is merged into the multi-layer metallic structure itself, rather than being implemented as separate components. The progressive spacing and configuration of metallic layers provide gradual impedance transformation across the broadband range, simplifying the overall device structure while maintaining excellent RF performance.

Impedance transformation is achieved by changing the geometric parameters of the metallic layers, such as their spacing, area, and configuration. By adjusting these parameters across different layers, the structure provides continuous impedance matching across the broadband frequency range without adding structural complexity.

Instead of additive manufacturing each antenna element individually, the design uses standard PCB fabrication techniques to create precise metallic patterns on substrates. This copying approach using established manufacturing processes achieves the required structural precision at lower cost and higher volume production rates.

The manufacturing approach is changed from additive manufacturing to subtractive PCB fabrication methods. By changing the manufacturing parameters and processes, the design achieves comparable or superior precision while significantly reducing production cost and increasing ease of manufacture through industry-standard techniques.