Compact Phased Array Antenna PCB Fabrication With Dielectric Gradients
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Solution Overview
Problem
Existing manufacturing methods for compact phased array antennas are costly and labor-intensive, involving disparate materials and complex fabrication steps.
Innovation Solution
The use of subtractive, additive, and hybrid manufacturing methods to form compact phased array antennas, specifically through multilayer printed circuit board (PCB) structures with dielectric gradients, allowing for efficient impedance matching and reduced manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional manufacturing methods are used for compact phased array antennas, then manufacturing precision and structural integrity can be maintained, but manufacturing cost and labor intensity increase significantly
Solution Approach 1:
The patent combines multiple manufacturing operations into integrated PCB fabrication processes. The antenna elements, dielectric structures, and conductive pathways are all formed within the same PCB manufacturing system, eliminating the need for separate fabrication steps and reducing overall manufacturing complexity while maintaining precision through standardized PCB processes.
Solution Approach 2:
The PCB structure serves multiple functions simultaneously: it provides the antenna elements, the dielectric substrate, the conductive pathways, and the mechanical support structure. This multi-functionality reduces the number of separate components and assembly steps needed, thereby simplifying manufacturing while maintaining structural integrity.
2Reliability
If disparate materials and complex fabrication steps are used, then antenna performance can be optimized, but manufacturing time and cost increase
Solution Approach 1:
The patent achieves impedance matching by varying the dielectric constant of the PCB substrate through controlled material composition rather than through complex geometric adjustments or additional matching components. This allows impedance optimization to be integrated into the base PCB fabrication process, maintaining manufacturing speed while achieving the required electrical performance.
Solution Approach 2:
The patent uses composite dielectric materials with tailored properties to achieve both the structural and electrical requirements of the antenna. By selecting PCB materials with specific dielectric constants and loss tangents, the design achieves optimal impedance matching and radiation characteristics without requiring additional material layers or complex fabrication steps.
3Strength
If compact phased array antennas are manufactured using conventional methods, then structural integrity is maintained, but manufacturing cost and time increase
Solution Approach 1:
The patent incorporates all antenna elements and supporting structures into a single pre-fabricated PCB assembly. The PCB is manufactured with all necessary conductive pathways, dielectric layers, and mechanical features already in place before the antenna elements are installed. This preliminary preparation of the substrate reduces assembly time and ensures structural integrity from the outset.
Solution Approach 2:
The patent integrates multiple functional elements within the PCB structure itself. The antenna elements are nested within or mounted on the PCB substrate, which contains the feed networks, impedance matching structures, and mechanical support features. This nesting approach consolidates multiple components into a single integrated structure, reducing both manufacturing time and overall size while maintaining strength.
Data Source
AI summary
The present disclosure teaches subtractive methods, additive methods, and hybrid additive/subtractive methods of forming a compact phased array antenna. In ore embodiment, the present disclosure provides a method of forming a compact phased array antenna that includes milling a plurality of spaced-apart antenna elements by removing material of a multilayer printed circuit board (PCB) structure, the multilayer PCB structure including a base dielectric layer and a plurality of stacked dielectric layers laminated together to form a unitary structure; forming a plurality of via holes in the base dielectric layer and adjacent the antenna elements; and depositing conductive material on the base dielectric layer and antenna elements.